Packaging Advancements Critical to Power Processing and Delivery Performance
Packaging for power electronics has evolved from simple metal bending to advanced materials and thermo-mechanical design, and from freestanding supply...
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Xilinx Showcases Smarter Solutions for Data Center Efficiency at Intel Developers Forum 2014
Bangalore, Sept 4, 2014 – Xilinx, Inc. announced it will showcase smarter solutions for data center efficiency at the Intel...
TSMC Adopts Cadence Solutions for 16nm FinFET Library Characterization
Virtuoso Liberate Characterization Solution and Spectre Circuit Simulator together double the speed of characterization for 16nm FinFET libraries Highlights: Output...
Indium Corporation Expands Shenzhen Sales Office to Accommodate Growth
Indium Corporation recently relocated its Shenzhen office to a larger facility at, West Tower, Qiushi Center, Room 1701, Zhuzlin, ShenNan...
FCI and Samtec Announces New Strategic Partnership
SINGAPORE (September 04 2014) — FCI Electronics and Samtec Inc., two leading suppliers of high speed connectors and interconnect systems,...
Analog Devices Introduces High-Temperature MEMS Gyro for Oil and Gas Drilling Equipment
Specified to 175-degree Celsius operation, the ±2,000°/sec ADXRS645 MEMS gyroscope replaces magnetometers in down-hole drilling applications as a reliable method...
Xerox Versant™ 2100 Press for the production printing industry.
India, September 5, 2014– As digital print applications continue to gain traction in today’s world, Xerox India has launched the...
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