FCT Assembly to Exhibit Innovative Pastes and Stencils at OctoberBest

GREELEY, CO — September 2014 — FCT Assembly today announced plans to exhibit in Booth # I105 at OctoberBest 2014, scheduled to take place Wednesday, October 1, 2014 at Tektronix in Beaverton, OR. Derek Stuart, FCT’s National Sales Manager, will be available to discuss the complete line of solution driven solder pastes and stencils.

FCT Assembly NanoSlic® Gold stencil FCT Assembly offers solder pastes that are specially formulated to solve various issues during the assembly process, including anti-tombstoning, low graping, low voiding, low melting, high activity and more. Additionally, FCT’s technical experts offer technical support for solder paste, SMT stencils, reflow profiling, root cause analysis and many other phases during the SMT process.

Stuart also will demonstrate the NanoSlic® Gold stencil – the next generation of stencil technology developed to address the increasing demands confronting the electronic assembly industry. The NanoSlic® technology significantly improves solder paste transfer efficiencies for small apertures resulting in higher yields and less rework. NanoSlic® also minimizes bridging and reduces underside cleaning. This technology can be easily evaluated and is compatible with current assembly equipment and processes.

FCT manufactures a complete line of products that reduce defects and increase yields during the printing process, including laser cut stencils and stencil coatings. Visit the FCT team at OctoberBest or go to www.fctassembly.com to find out why FCT has the best performing products on the market.

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