Indium Corporation to Feature Solder Paste for HIA, SiP at IMAPS Advanced SiP

Indium3.2HF-Solder-PasteIndium Corporation will feature its proven solder paste for Heterogeneous Integration & Assembly (HIA) and system-in-package (SiP) applications at Advanced System in Package (SiP) Technology Conference & Exhibition, June 25-27 in Monterey, California.

Indium Corporation’s Indium3.2HF Solder Paste meets current and evolving challenges encountered in fine-pitch Heterogeneous Integration and SiP applications. Indium3.2HF delivers:

  • Consistent printing performance
  • Long stencil life
  • Outstanding slump resistance
  • Excellent wetting ability
  • Superior fine-pitch soldering ability
  • Water solubility

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