Indium Corporation Expert to Present at IMAPS Advanced SiP

Indium Corporation’s Sze Pei Lim, Regional Product Manager for Semiconductor Products, will share her expertise at the Advanced System in Package (SiP) Technology Conference & Exhibition, June 25-27 in Monterey, California. Lim will present Soldering Material Challenges for Heterogeneous Integration…

SAN JOSE, CA ―May2019 ― SHENMAO America, Inc. offers PF719 Thermal Fatigue Resistance Pb-Free Solder Alloy.PF719 provides excellent thermal fatigue reliability. The alloy offers a similar operating temperature window to typical SAC alloys. While the consumer electronics industry has widely…
Electrolube Launch New Encapsulation Resins at IEW India

Electro-chemicals and circuit protection specialist, Electrolube are returning to India Electronics Week 2019 to showcase new encapsulation resins, thermal management products and conformal coatings on their booth (I32) Bengaluru, India, February 26-28 2019. India’s Electronics Week is an important platform…
Indium Corporation’s  2019 Outlook

Christopher Nash, Solder Paste Product Manager It is truly an exciting time to be involved in the electronics assembly industry. Indium Corporation has seen tremendous growth in 2018 and future growth appears inevitable with the abundance of new technoloy, technological…

Somerset,NJ–November 16,2018–Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, has attained International Automotive Task Force (IATF) 16949:2016 certification for all manufacturing facilities globally that produce products for automotive applications. “With the key role…
Alpha Introduces AccuFlux™ BTC-578 Preforms

For Improved Thermal Management on Bottom Termination Components Somerset,NJ–October 30,2018–Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, has recently introduced ALPHA® AccuFlux™ BTC-578 Solder Preforms, designed to enhance reliability and heat transfer through…