Indium Corporation to Feature AuSn Solder Preforms at HiTEN 2019

Indium Corporation will feature its high-reliability precision AuSn Solder Preforms at the International Conference and Exhibition on High Temperature Electronics Network(HiTEN), July 8-10, Oxford, United Kingdom. Indium Corporation’s high-temperature AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and…
Indium Corporation to Feature Solder Paste for HIA, SiP at IMAPS Advanced SiP

Indium Corporation will feature its proven solder paste for Heterogeneous Integration & Assembly (HIA) and system-in-package (SiP) applications at Advanced System in Package (SiP) Technology Conference & Exhibition, June 25-27 in Monterey, California. Indium Corporation’s Indium3.2HF Solder Paste meets current and evolving challenges encountered…
Electrolube Launch New Encapsulation Resins for the Indian Market

Electrolube, the leading electro-chemicals and circuit protection specialist, has launched a brand new series of encapsulation resins specifically for the Indian market.  Formulated at the company’s manufacturing facility in Bangalore, the new resins have been produced using local materials to…
Indium Corporation Expert to Present at IMAPS Advanced SiP

Indium Corporation’s Sze Pei Lim, Regional Product Manager for Semiconductor Products, will share her expertise at the Advanced System in Package (SiP) Technology Conference & Exhibition, June 25-27 in Monterey, California. Lim will present Soldering Material Challenges for Heterogeneous Integration…

SAN JOSE, CA ―May2019 ― SHENMAO America, Inc. offers PF719 Thermal Fatigue Resistance Pb-Free Solder Alloy.PF719 provides excellent thermal fatigue reliability. The alloy offers a similar operating temperature window to typical SAC alloys. While the consumer electronics industry has widely…
Electrolube Launch New Encapsulation Resins at IEW India

Electro-chemicals and circuit protection specialist, Electrolube are returning to India Electronics Week 2019 to showcase new encapsulation resins, thermal management products and conformal coatings on their booth (I32) Bengaluru, India, February 26-28 2019. India’s Electronics Week is an important platform…