Indium Corporation to Feature Solder Paste for HIA, SiP at IMAPS Advanced SiP

Indium Corporation will feature its proven solder paste for Heterogeneous Integration & Assembly (HIA) and system-in-package (SiP) applications at Advanced System in Package (SiP) Technology Conference & Exhibition, June 25-27 in Monterey, California. Indium Corporation’s Indium3.2HF Solder Paste meets current and evolving challenges encountered…
Indium Corporation’s  2019 Outlook

Christopher Nash, Solder Paste Product Manager It is truly an exciting time to be involved in the electronics assembly industry. Indium Corporation has seen tremendous growth in 2018 and future growth appears inevitable with the abundance of new technoloy, technological…