Indium Corporation Expert to Present at IMAPS Advanced SiP

Indium Corporation’s Sze Pei Lim, Regional Product Manager for Semiconductor Products, will share her expertise at the Advanced System in Package (SiP) Technology Conference & Exhibition, June 25-27 in Monterey, California. Lim will present Soldering Material Challenges for Heterogeneous Integration…
SHENMAO Launches PF606-PW215 Water-Soluble Solder Paste

SAN JOSE, CA ― July 2018 ― SHENMAO America, Inc. is pleased to introduce the PF606-PW215water-soluble solder paste. The company offers a full line of water-soluble fluxes and solder pastes for SMT and IC packaging applications. SHENMAO provides halide-containing and…

Indium Corporation and MEL Systems and Services Ltd. (MELSS) have formed a strategic partnership to expand accessibility to Indium Corporation soldering materials throughout India. MELSS will be selling all of Indium Corporation’s soldering materials, such as low-voiding solder paste and…
SHENMAO Introduces New Low Residue Liquid Flux  SMF-WB51 for WLCSP/FOWLP,

SHENMAO Technology. Inc. introduces New Generation Ultra Low Residue Liquid Flux SMF-WB51with superior sprayuniformity, excellent soldering performance and a wide process window for Chip Scale and Fan Out Wafer Level Packaging. SHENMAO introduces New Generation Lead-free Solder Paste PF606-P140 and…