Indium Corporation to Feature AuSn Solder Preforms at HiTEN 2019

Indium Corporation will feature its high-reliability precision AuSn Solder Preforms at the International Conference and Exhibition on High Temperature Electronics Network(HiTEN), July 8-10, Oxford, United Kingdom. Indium Corporation’s high-temperature AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and…
Indium Corporation Expert to Present at IMAPS Advanced SiP

Indium Corporation’s Sze Pei Lim, Regional Product Manager for Semiconductor Products, will share her expertise at the Advanced System in Package (SiP) Technology Conference & Exhibition, June 25-27 in Monterey, California. Lim will present Soldering Material Challenges for Heterogeneous Integration…
SHENMAO Launches PF606-PW215 Water-Soluble Solder Paste

SAN JOSE, CA ― July 2018 ― SHENMAO America, Inc. is pleased to introduce the PF606-PW215water-soluble solder paste. The company offers a full line of water-soluble fluxes and solder pastes for SMT and IC packaging applications. SHENMAO provides halide-containing and…