Alpha Introduces Ultra-Low Voiding Solder Paste Designed for Vacuum Solder Reflow

Somerset,NJ–December 12,2018–Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, has recently introduced ALPHA® OM-355, designed specifically for vacuum soldering applications.

“In-line vacuum soldering capabilities are becoming more common as power density increases on BGAs and as BTC component packages require effective heat dissipation through void reduction”, said Paul Salerno, Global Portfolio Manager for SMT Solutions at Alpha Assembly Solutions. “This solder paste has an activator system that is optimized for the vacuum soldering reflow process to control the rate of volatilization and reduction in surface tension which allows voids to escape under reducing atmosphere.  This promotes ultra-low voiding below 5% without the post-reflow defects commonly associated with vacuum soldering”.

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Part of Alpha’s Void Reduction Solutions, ALPHA® OM-355 is compatible with SAC305, Innolot and MAXREL™ Plus alloys.  The ALPHA® OM-355 MAXREL™ Plus solder paste is intended for final assemblies in automotive, defense, aerospace, telecommunications, or any device requiring power management and high reliability.

For more information on ALPHA® OM-355 Solder Paste, visit the Alpha website.

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