Infineon first to master handling and processing of ultra-thin 20-micrometer power semiconductor wafers Reducing wafer thickness cuts substrate resistance in ...
Read moreNew high-volume 200mm silicon carbide manufacturing facility for power devices and modules, as well as test and packaging, to be ...
Read moreNew jointly-operated, high-volume manufacturing facility to support European and global customers’ demand as the world transitions to digitalization and decarbonizationNew ...
Read moreTessenderlo, Belgium – October 2, 2019 X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry has announced that it ...
Read moreThe International Test Conference (ITC) India is an initiative to support India’s semiconductor growth. Launched in 2016 under the International ...
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