Rehm is expanding the machine park at the Technology Centre with new solder paste and coating inspection systems
The processing of a circuit board directly influences product quality. Above all, the reliability of the production processes is of great importance. In order to be able to more closely inspect the quality directly after the printing or painting process, two new inspection systems of the TROI series from Pemtron are now in use at the Rehm Technology Centre in Blaubeuren. In Germany, the equipment of the Korean manufacturer is distributed by ANS answer elektronik, which already looks back on a long-term collaboration with Rehm Thermal Systems.
“Our aim is not only to provide high-quality equipment for the inspecting and testing of electronic assemblies, but also to support our customers during process improvement. An impeccable paste print during soldering or a precise application of lacquer in the case of conformal coating is the basis for all further process steps, especially with regard to the increasing miniaturisation of components. The new solder paste and conformal coating inspection systems of the TROI series optimally complement our machine park and ensure the best possible analysis results”, explains Helmut Öttl, Head of Process Development/Application at Rehm.
The 3D SPI system has a patent for the joint and/or separate use of 2D and 3D image captures. This ensures maximum accuracy at high speed. It is outstanding that the systems, in contrast to those of other manufacturers, start with the measurement at zero. An ordinary 3D solder paste inspection system generates a wire mesh model to display the paste application. Pemtron, on the other hand, has developed a patented, advanced ‘colour mapping algorithm’ that generates a graphical ‘live colour image’ of the paste job. The 3D projection is based on Moiré technology, takes place from two sides and determines the entire height of the paste without shadowing.
The conformal coating inspection system also has UV as well as RGB illumination. The coating is assessed by means of a good-bad comparison. Areas that are not inspected can be easily removed. A unique characteristic is the automatic layer thickness measurement in this system. The lacquer application can be tested at different positions on the printed circuit board using a height sensor.
“The user can simultaneously apply the systems as a kind of microscope, recognising, for example, whether too much, too little or no material has been applied, as well as whether bridges, a deformed application or a material mislocation are present. Programming is also very simple and can be performed very quickly in both systems. Pseudo errors are reduced to an absolute minimum and only faultless assemblies are processed further”, says Hans-Jürgen Lütter, Managing Director of ANS answer elektronik. Comprehensive SPC software rounds off the systems, which enable inspection at the highest level and ensure a much better technical statement and quality assessment.
