ASM introduces a new and improved addition to the SIPLACE TX series – SIPLACE TX micron. This machine is equipped with hardware and software enhancements in order to achieve high placement performance in combination with high accuracy.
The speed of the SIPLACE TX micron is benchmarked at 78,000 cph with two of the latest SIPLACE SpeedStar placement head, and the machine is capable of reaching a placement accuracy of 15 µm at 3σ with the following options :
- Enhanced & stiffer conveyor system
- Special Vacuum tooling with high accuracy glass bars in the front and rear of the substrate
- High precision Flag set for 15 µm for the components shapes required
The SIPLACE TX micron is applicable for Bare Die (DA), Flip Chip including dipping (FC) and standard SMD components for intelligent sensors modules, medical devices, wearables, SiP (System-in-packaging) for mobile devices and submodules which requires the highest accuracy and performance.
Key Specifications of the SIPLACE TX micron include:
- Standard accuracy of 25 µm @ 3σ and optional 20 µm and 15 µm @ 3σ
- Bump size down to 50 µm and lead width down to 30 µm
- Clean room ISO 7 and Semi S2/S8 certified
- Proven recognition of 0201m, copper-pillars FC
For more information, please click here or contact us at smt-solutions.sg@asmpt.com .
