Indium Corporation will feature its WS-575-C Ball-Attach Flux at Microelectronics Tech Asia Singapore, July 4-5, 2017 in Singapore.
Indium Corporation’s WS-575-C Ball-Attach Flux is halogen-compliant (“no-intentionally-added” halogens) and designed as a true one-step ball-attach process for Cu OSP substrates. WS-575-C eliminates many assembly issues, such as missing ball, weak joints, and voiding.
WS-575-C can be completely cleaned using room temperature deionized (DI) water, significantly reducing the costs of heating water.
For more information on WS-575-C Ball-Attach Flux , visit www.indium.com/ballattachflux or visit Indium Corporation at booth 14.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
