Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will lead three sessions at the IPC APEX Expo technical conference on February 11-16 in San Diego, Calif.
Dr. Lee will chair a two-part advanced professional development course on Choosing Solders for the New Era. Part 1 will be on Feb. 12 from 9 a.m.-noon, and part 2 will the same day from 2-5 p.m. Dr. Lee will also moderate a technical session on Solder Reliability on Feb. 14 from 1:30-3 p.m.
Eric Bastow, Assistant Technical Manager, will moderate a session on Miniaturization on Feb. 16 from 9-10 a.m.; and Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will moderate a session on SIR Reliability on Feb. 14 from 3:30-5 p.m.
Technical presentations by Indium Corporation experts will include:
Does Thermal Cycling Impact the Electrical Reliability of No-Clean Solder Paste Flux Residue? by Eric Bastow, Assistant Technical Manager
Process Optimization for Fine-Feature Solder Paste Dispensing by Maria Durham, Technical Support Engineer for Semiconductor and Advanced Assembly Materials
Voiding Performance with Modified SAC Alloys for Automotive Applications and Understanding the Effect of Different Heating Cycles by Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials
For more information on the technical sessions offered at IPC APEX, visit www.ipcapexexpo.org.
In addition to sharing their expertise at technical sessions, Indium Corporation will have a variety of technical experts at their exhibit to meet with customers. To schedule a one-on-one meeting with an Indium Corporation technical engineer on how to Avoid the Void™ to achieve reliability, productivity, and satisfied customers, contact Glen Thomas, Product Support Manager, PCB Solder Paste, at gthomas@indium.com. Experts will also be at Indium Corporation’s booth, #1011, to discuss unique applications, provide insights, and answer questions From One Engineer To Another®. For more information, visit www.indium.com/avoidthevoid.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.
