Xilinx Stays a Generation Ahead at 16nm with New Memory, 3D-on-3D, and Multi-processing SoC Technologies
New UltraScale+ FPGA, SoC, and 3D IC applications include LTE Advanced and early 5G wireless, terabit wired communications, automotive ADAS,...
New UltraScale+ FPGA, SoC, and 3D IC applications include LTE Advanced and early 5G wireless, terabit wired communications, automotive ADAS,...
At the embedded world 2015 in Nuremberg GOEPEL electronics announced the availability of the VarioTAP software option for the processors...
Device Offers Excellent Temperature Compensation in Compact 2.35 mm by 1.8 mm by 1.0 mm Package MALVERN, Pa. — Feb....
New High-efficiency Thru Hole Power Inductors are a Cost-effective Option for Switch Mode Power Supply Applications. Cary, IL, USA -...
POMONA, CALIFORNIA – February 2015 – Highpower4S, the company that set the grow world spinning with their Phoquan technology full-spectrum...
New embedded SIM controllers enable secure and reliable cellular M2M communication for connected cars, industrial automation, smart cities and more;...
Low-Power Barometric Pressure Sensor from Infineon Delivers New Levels of Accuracy for Mobile and Wearable Gadgets and IoT Devices Munich,...
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