TI unveils breakthroughs in energy efficiency, power density and new tools to speed power supply design
Bangalore, 2nd March 2015 — Texas Instruments (TI), the worldwide leader in power management integrated circuits, will demonstrate how its analog technologies and embedded processing are driving innovation in energy management for next-generation power designs at the Applied Power Electronics Conference (APEC), March 16-18, in Charlotte, North Carolina.
Experience the interactive Multimedia News Release here: http://www.multivu.com/players/English/70647526-texas-instruments-apec-2015/
TI will highlight advancements in digital power and gallium nitride (GaN) technology and debut sophisticated new tools that help speed the design of power supplies for industrial, smart grid and automotive applications. Join representatives in booth No. 1001 as TI unveils new product demonstrations; awards prizes; and uncovers end-to-end power management system designs including hardware, software and reference designs that help power supply engineers get to market quickly. For more information and to follow TI throughout APEC, see http://www.ti.com/apec15.
APEC attendees can experience TI’s power management solutions including the following key system demonstrations:
· Digital power: Dynamic synchronous rectification control, end-to-end PMBus point-of-load DC/DC solutions, hardware and graphical software tools for digital power configuring and modeling, and tools for converting solar energy into electricity.
· DC/DC: Wide VIN multirail power made simple with SIMPLE SWITCHER® nano modules and synchronous regulators, as well as automotive start-stop power.
· LED lighting: An efficient, step-down, high-power LED driver with strobe and synchronization for fire alarms.
· WEBENCH® power design tools and TI Designs reference design library. TI will offer a USB stick to attendees with reference designs for many of the demos in the booth.
Power experts from TI will also present at many technical sessions, including two focused on the impact of wide-bandgap power devices and how TI is making GaN technology more reliable.
