June 29, 2016 – Henkel Adhesive Technologies’ Electronics business has developed and launched the latest product in its line of award-winning GAP PAD thermal interface materials (TIMs). The new GAP PAD HC 5.0 is designed to manage the heat generated by today’s reduced form factor, high power density components.
A soft and compliant gap filling material, GAP PAD HC 5.0 has a thermal conductivity of 5.0 W/m-K and delivers outstanding thermal performance with very low compression stress. The low modulus and unique filler package is ideal for applications that require minimal component or board stress during assembly, yet demand high heat transfer across the interface with very low thermal resistance.
“As electronic components have reduced in size, the power densities have increased,” explains Danny Leong, GAP PAD HC Product Line Manager. “The requirement for effective thermal management is greater than ever before. In the case of high value, high power products like those used within internet and computing infrastructures, superior heat transfer is a necessity and GAP PAD HC 5.0 delivers.”
