As the electronics industry pushes for higher packaging density, the trend towards System in packages increases. The key element of success in System in Package (SIP) industry is the ability to tightly control each assembly process to ensure high yields. One of the advances in semiconductor process technology is the enablers to higher solder bump densities and therefore, tighter bump pitches.
Flux and solder paste deposition are standard steps during flip chip and component attach process within the SIP assembly. SIP printing involves 2 separate printing processes with the first layer of flux printed followed by the solder paste. Flux printing needs to have precise control of the flux deposited to ensure the flux will activate and burn off during reflow, limiting flux residue. The second process of printing the solder paste involves designing a “cap” over the printed.
With the push for higher volumes and lower cost in the industry, this method of flux printing proves to be a more efficient way by lowering cost and eliminating the traditional line bottlenecks, compared to traditional methods for flux coating via dispensing or flux dipping.
DEK has vast experience in handling flux printing for more than 20 years. With the DEK process support products, DEK is able to offer a total flux and solder paste printing solution including printers, stencils and toolings.
