Electronics Maker, Author at Electronics Maker

Bangalore, September 05, 2014: The classiest tablet in town has arrived and is sure to make heads turn. Presenting the...

Lenovo VIBE X2 powered by MediaTek LTE True Octa-core™ SoC

by Electronics Maker

September 5, 2014

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Further broadening consumers’ choices of powerful LTE devices Bangalore, India – September 4th, 2014 – MediaTek and Lenovo today announced...

Figure 4: Advanced packaging technologies, such as Vicor’sChiP, support symmetrical thermal designs exploiting top- and bottom-side cooling.

Packaging Advancements Critical to Power Processing and Delivery Performance

by Electronics Maker

September 4, 2014

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Packaging for power electronics has evolved from simple metal bending to advanced materials and thermo-mechanical design, and from freestanding supply...

Xilinx Showcases Smarter Solutions for Data Center Efficiency at Intel Developers Forum 2014

by Electronics Maker

September 4, 2014

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Bangalore, Sept 4, 2014 – Xilinx, Inc. announced it will showcase smarter solutions for data center efficiency at the Intel...

TSMC Adopts Cadence Solutions for 16nm FinFET Library Characterization

by Electronics Maker

September 4, 2014

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Virtuoso Liberate Characterization Solution and Spectre Circuit Simulator together double the speed of characterization for 16nm FinFET libraries Highlights: Output...