Indium Corporation Technical Expert to Present at IMAPS France Workshop
Indium Corporation’s Graham Wilson, applications engineer, will present at the IMAPS France Workshop on Thermal Management in La Rochelle, France, on Feb. 5, 2015. Wilson’s...
Preview for JTAG Technologies for the Embedded World Nuremberg
February 24th -26th, 2015, Booth 578 in Hall 4 Eindhoven, December 2014 -- JTAG Technologies BV (Eindhoven, The Netherlands), a...
Essemtec to Debut New Small Form Factor SMT Assembly System at APEX
Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, will exhibit in Booth #1211 at the IPC...
New test and programming strategies for Intel processors
GOEPEL electronics introduces new test and programming strategies for Bay Trail processors from Intel® GOEPEL electronics announces the development of...
MediaTek Reveals the Future of Premium Wireless Connectivity With Its New MT7615 SoC
802.11ac Wave2 chipset with MU-MIMO support designed for high-end home gateway, set-top box, video bridge, router and enterprise-class AP New...
Global 3D Camera Market is Expected to Reach $7.6 Billion by 2020
By Allied Market Research According to a new report by Allied Market Research titled, "Global 3D Camera Market - Size,...
STMicroelectronics Begins Shipping Next-Generation Ultra-HDp60 STB Chips
Quad-core SoCs reach lead customers with HEVC 10-bit resolution and VP9 New Delhi, January 7, 2015 – STMicroelectronics , a...
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