STMicroelectronics Reports 2016 Fourth Quarter and Full Year Financial Results
Fourth quarter net revenues up 3.5% sequentially and 11.5% year-over-year Fourth quarter gross margin of 37.5%, above our guidance,...
TopLine’s Micro-coil Springs (MSC) for CCGAs in Harsh Environments Featured at IPC/APEX EXPO 2017
Absorbs Extreme Shock CCGA and BGA Components; Novel Interconnect Innovation Milledgeville, Georgia, USA – TopLine, a leading designer and manufacturer...
ZTE Achieves Performance Breakthrough for Deep Learning with Intel FPGAs
Intel and ZTE, a leading technology telecommunications equipment and systems company, have worked together to reach a new benchmark in...
Swedish solar energy expert Midsummer’s client now produces lightweight flexible solar modules with conversion efficiency at 14 per cent
Midsummer, a leading supplier of production lines for cost effective manufacturing of lightweight flexible CIGS solar cells, today announced that...
Alps Electric Develops and is to Commence Mass Production of “FLGPJ Series”
Alps Electric has developed the “FLGPJ Series” Narrow Aspherical Glass Lens suitable for compact, high-density optical transceivers. Mass production will...
Highly reliable automotive-grade surface mount multilayer ceramic chip capacitors from KEMET now available through TTI, Inc.
January 2017 – Now available in Europe through TTI, Inc., a world leading specialist distributor of electronic components, are KEMET’s...
Fourth-Generation 600 V E Series Power MOSFET Lowers Conduction and Switching Losses, Increases Efficiency
Superjunction Device Provides Industry's Lowest RDS(ON)*Qg FOM for Telecom, Industrial, and Enterprise Applications MALVERN, Pa. — Jan. 26, 2017 —...
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