Vicor introduces two new DCMs in a VIA Package
The DCM in a VIA Package is a ruggedized modular DC-DC converter that operates from an unregulated, wide range input,...
Intel’s Drone Dancers Wow Millions During Halftime Show
We all know that drones — also known as quadcopters or unamanned aerial vehicles (UAVs) — have seen explosive popularity...
Distributed Heterogeneous Processing Opens New Applications for FPGAs
Increasingly lower cost sensors, the migration to higher performance I/O interfaces, and the demand for “always-on, always-aware” functionality all present...
RS Components Offers Access to SamacSys PCB Schematics
RS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), the global distributor for engineers, announced it has extended its...
Annual Silicon Volume Shipments Remain at Record Highs
Revenues continue to be under pressure MILPITAS, Calif. — February 6, 2017 — Worldwide silicon wafer area shipments increased 3...
MediaTek Introduces Helio P25 Premium Performance Chip For Dual-Camera Smartphones
Newest MediaTek mobile chipset combines Octa-core processing and a superior set of camera features for an impressive consumer experience Bangalore,...
Maini Group to Participate in AEROINDIA 2017
February 07, 2017, Bengaluru: Maini Group, one of India’s premier design and manufacturing entities, is set to participate in the...
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