YESTech ‘s advanced Thin Camera technology offers off-line benchtop PCB inspection with exceptional defect coverage.This benchtop system inspects solder joints and verifies correct part assembly enabling uers to improve quality and increase throughput.
The B3 is equally effective for pre / post-reflow or even final assembly inspection.Programming the B3 is fast and intuitive.Operators typically take less than 30 minutes to create a complete inspection program including solder inspection.Remote programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.
YTV B3 AOI system used for Inspection of Solder & lead defects, Component presence and position, Correct part, Polarity, Through-hole-parts and paste. The maximum PCB size it can handle is 457mm x 508mm and minimum component size is 01005.The throughput is 4 sq.in./sec i.e. More than 2 Lakhs components per hour.
For enquiries contact:
M/s Qmax Test Technologies Pvt Ltd.
6, ELCOT Avenue, IT Highway, Sholinganallur, Chennai 600 119.
Phone : 044-24509627 Fax : 044-24509632
E-mail : sales@qmaxtest.com
Web : www.qmaxtest.com
