Kennesaw, Georgia, USA – Yamaha Motor Corporation USA‘s Intelligent Machinery (IM) Division announces the launch of the YSP10, The industry’s first solder paste printer that boasts a completely automatic changeover system. The YSP10 is the successor to the YSP, a high-end printer that features a completely programmable squeegee angle adjustment and stencil suction mechanism as standard equipment.
The YSP10 has been newly designed and developed from the ground up in order to enable full automation of production changeover, which typically occupies a large amount of working time during an average production shift.
In addition to existing automatic program changeover and Print Stability Control (PSC) systems, fully automatic changeover is enabled by automatic support pin exchange, automatic stencil replacement and automatic solder paste transfer functions. It is this last feature which is truly inovative: Removing solder paste from an existing stencil and transferring it to another in about one minute with zero operator interaction.
In addition, the overall process cycle time (including stencil cleaning) has been improved by 20%. Other enhancements include compatibility with a wider range of circuit board sizes and a significant reduction in cleaning paper consumption volume with its redesigned stencil wiper system.
By automating the changeover process, the YSP10 is designed not only to eliminate operator involvement in this step, but to also dramatically reduce the time it takes to change programs. Reducing the changeover time from more than 15 minutes to a mere 2 minutes (under optimal conditions) allows a higher mix of product to be run in a production line while improving overall Operational Equipment Efficiency (OEE).
