Electronics Maker
  • Home
  • Electronics News
  • Articles
  • Magazine
  • Events
  • Interview
  • Electronics Projects
No Result
View All Result
  • Home
  • Electronics News
  • Articles
  • Magazine
  • Events
  • Interview
  • Electronics Projects
No Result
View All Result
Electronics Maker
No Result
View All Result
Home Electronics News

Xilinx Expands its 16nm UltraScale+ Product Roadmap to Include Acceleration Enhanced Technologies for the Data Center

Electronics Maker by Electronics Maker
May 25, 2016
in Electronics News
0
0
SHARES
34
VIEWS
Share on FacebookShare on Twitter

Combines 16nm UltraScale+ programmable logic with HBM memory and new accelerator interconnect technology for heterogeneous computing

Bangalore, May. 25, 2016 – Xilinx, Inc. today announced expansion of its 16nm UltraScale+™ product roadmap with new acceleration enhanced technologies for the Data Center. The resulting products will deliver the powerful combination of Xilinx’s industry-leading 16nm FinFET+ FPGAs with integrated High-Bandwidth Memory (HBM), and support for the recently announced Cache Coherent Interconnect for Acceleration technology (CCIX). CCIX is initially driven by a group of seven companies to enable an acceleration framework that works with multiple processor architectures. These acceleration enhanced technologies will enable efficient heterogeneous computing for the most demanding data center workloads. The new products will also be highly leveraged in many other compute intensive applications requiring high memory bandwidth.

Built on the TSMCs proven CoWoS process, Xilinx® HBM-enabled FPGAs will improve acceleration capabilities by offering 10X higher memory bandwidth relative to discrete memory channels. HBM technology enables multi-terabit memory bandwidth integrated in package for the lowest possible latency. To further optimize data center workloads, the new CCIX technology promotes efficient heterogeneous computing by allowing processors with different instruction-set architectures to coherently share data with accelerators such as the Xilinx HBM-enabled FPGAs.

“Having already delivered 19 billion transistors on a chip at 20nm leveraging our second generation 3D IC technology, we are creating a third generation 3D IC breakthrough  for data center acceleration and other compute intensive designs,” said Victor Peng, executive vice president and general manager, Programmable Products at Xilinx. “When combined with next generation CCIX acceleration framework and our software defined SDAccel™  development environment, this technology will enable a new breed of high-density, flexible platforms for accelerating compute, storage and networking applications.”

Xilinx is already collaborating with leading hyperscale data center customers to create optimized configurations and products.

Tags: FPGASemiconductor & IC
Electronics Maker

Electronics Maker

Subscribe Newsletter

Subscribe to our mailing list to receives daily updates direct to your inbox!

*we hate spam as much as you do

Electronics Maker

It is a professionally managed electronics print media with highly skilled staff having experience of this respective field.

Subscribe Newsletter

Subscribe to our mailing list to receives daily updates direct to your inbox!

*we hate spam as much as you do

Quick Links

  • »   Electronics News
  • »   Articles
  • »   Magazine
  • »   Events
  • »   Interview
  • »   About Us
  • »   Contact Us

Contact Us

EM Media LLP
  210, II nd Floor, Sager Plaza – 1, Road No-44,, Plot No-16, Pitampura, New Delhi - 110034
  01145629941
  info@electronicsmaker.com
  www.electronicsmaker.com

  • Advertise with Us
  • Careers
  • Terms Of Use
  • Privacy Policy
  • Disclaimer
  • Cookie Policy

© 2020 Electronics Maker. All rights reserved.

No Result
View All Result
  • Home
  • Electronics News
  • Articles
  • Magazine
  • Events
  • Interview
  • Electronics Projects

© 2020 Electronics Maker. All rights reserved.

-