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TI’s NexFET™ N-channel power MOSFETs achieve industry’s lowest resistance

Electronics Maker by Electronics Maker
January 20, 2015
in Electronics News
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Lowest Rdson 25-V and 30-V devices in 5 mm by 6 mm QFN package

Bangalore, 20th January 2015 — Texas Instruments (TI) introduced 11 new N-channel power MOSFETs to its NexFET™ product line, including the 25-V CSD16570Q5B and 30-V CSD17570Q5B for hot swap and ORing applications with the industry’s lowest on-resistance (Rdson) in a QFN package. In addition, TI’s new 12-V FemtoFET™ CSD13383F4 for low-voltage battery-powered applications achieves the lowest resistance at 84-percent below competitive devices in a tiny 0.6 mm by 1 mm package. For more information, samples or a reference design, visit www.ti.com/csd16570q5b-pr.

TI's NexFET™ N-channel power MOSFETsThe CSD16570Q5B and CSD17570Q5B NexFET MOSFETs deliver higher power conversion efficiencies at higher currents, while ensuring safe operation in computer server and telecom applications. For instance, the 25-V CSD16570Q5B supports a maximum of 0.59 milliohms of Rdson, while the 30-V CSD17570Q5B achieves a maximum of 0.69 milliohms of Rdson. Read a blog, “Power MOSFET safe operating area (SOA) curves for designing with hot-swap and ORing FET controllers.”  Download a 12-V, 60-A hot swap reference design featuring TI’s CSD17570Q5B NexFET.

TI’s new CSD17573Q5B and CSD17577Q5A can be paired with the LM27403 for DC/DC controller applications to form a complete synchronous buck converter solution. The CSD16570Q5B and CSD17570Q5B NexFET power MOSFETs can be paired with a TI hot swap controller such as the TPS24720. Download the application note “Robust Hot Swap Designs” to understand how a transistor is selected as a pass element and how to ensure safe operation under all possible conditions.

New NexFET products and key features

Part Number Application Vds/Vgs Package (mm) Rdson max (mohm) Qg (4.5) (nC)
4.5V 10V
CSD16570Q5B ORing/Hot Swap 25/20 QFN 5×6 (Q5B) 0.82 0.59 95
CSD17570Q5B 30/20 0.92 0.69 93
CSD17573Q5B Low Side Buck/
ORing/Hot Swap
30/20 QFN 5×6 (Q5B) 1.45 1.0 49
CSD17575Q3 Low Side Buck 30/20 QFN 3.3×3.3 (Q3) 3.2 2.3 23
CSD17576Q5B QFN 5×6 (Q5B) 2.9 2.0 25
CSD17577Q5A High Side Buck 30/20 QFN 5×6 (Q5A) 5.8 4.2 13
CSD17577Q3A QFN 3.3×3.3 (Q3A) 6.4 4.8 13
CSD17578Q3A 9.4 7.3 7.9
CSD17579Q3A 14.2 10.2 5.3
CSD85301Q2 Dual Independent FET 20/10 QFN 2×2 (Q2) 27 N/A 4.2
CSD13383F4 Load Switch 12/10 FemtoFET 0.6×1.0 (0402) 44 N/A 2.0

 

Availability, packaging and pricing

Available in volume now from TI and its authorized distributors, the products range in price from US$0.10 for the FemtoFET CSD13383F4 to US$1.08 for the CSD17670Q5B and CSD17570Q5B, all in 1,000-unit quantities.

About TI’S NexFET power MOSFETs

TI’s NexFET power MOSFETs improve energy efficiency in high-power computing, networking, industrial and power supplies. These high-frequency, high-efficiency analog power MOSFETs give system designers access to the most advanced DC/DC power conversion solutions available.

Tags: Power ElectronicsSemiconductor & IC
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