New TI DLP® chipset enables twice the signal-to-noise ratio in the palm of your hand
Bangalore, 13th March 2015 — Today at Pittcon 2015, Texas Instruments (TI) announced the expansion of its near-infrared (NIR) chipset portfolio with the industry’s first fully programmable micro-electro mechanical systems (MEMS) chipset that enables ultramobile analysis for a 700-2,500 nm wavelength range.
The DLP chipset, consisting of the DLP2010NIR digital micromirror device (DMD), DLPA2005 integrated power management and DLPC150 controller, boasts low power consumption, programmable high-speed patterns and the latest high-tilt 5.4μm pixel size for use in compact optical designs. For more information, visit www.ti.com/DLPNIR.
The DLP2010NIR DMD is the smallest, most efficient DLP chip and is designed for a variety of handheld NIR sensing application areas, including spectrometers and chemical analyzers.2 Application areas include farming, food and drink, petrochemical, health, and skin care industries. When the chipset is paired with the Bluetooth® and Bluetooth low energy-enabled DLP NIRscan™ Nano evaluation module (EVM), designers can easily prototype portable analyzers to accelerate the development of ultramobile spectrometers.
Key features and benefits of the DLP2010NIR chip
· The two-dimensional micromirror array combined with a single point detector provides a lower cost and greater signal capture than linear array systems.
· A wide NIR-window transmittance of 700-2,500 nm enables accurate spectral analysis and the measurement of a variety of materials.
· Its small size and 17-degree pixel tilt allow for compact, side illuminated optical engine designs, suitable for handheld or embedded systems.
· The chip’s programmable high-speed 854 x 480 micromirror array allows advanced filtering for fast measurements in handheld applications.
Key features and benefits of the DLP NIRscan Nano EVM
· An industry-leading cost point for laboratory analytics makes it accessible to optical module developers, electronics and software developers, and applications developers.
· A high-resolution wavelength range of 900-1,700 nm in a pocket-sized form factor (90 cm3) complements its high-resolution predecessor, the DLP NIRscan EVM.
· Bluetooth and Bluetooth low energy functionality of the embedded TI dual-mode Bluetooth CC2564 wireless network processor module, which provides iOS and Android™ app developers the ability to create apps to wirelessly connect to the EVM platform.
· The TM4C129x microcontroller enables highly connected products with its integrated ARM® Cortex®-M4 CPU, 1MB flash, 256KB RAM, 10 I2Cs, eight UARTS, four QSPIs, USB 2.0 and much more.
· When adding a battery, the evaluation module has efficient charging with the bq24250, a I2C controlled or standalone 2-A single-cell switch-mode USB charger that charges battery fast and efficiently with great flexibility. The charger offers power path, input current and voltage dynamic power management, as well as system power up with deeply discharged or missing battery.
To accelerate end-product development, TI maintains an extensive ecosystem of design houses. The DLP Design Network provides developers a diverse network to support their hardware and software integration, optics design, system integration, prototyping, manufacturing services, and turnkey solutions structured to support current and evolving customer needs.
