Neubiberg, Germany –May 15, 2014– Infineon Technologies introducesa new leadless surface mounted(SMD) package for CoolMOS™ MOSFETs named ThinPAK 5×6.
Chargers for mobile devices, Ultra High Definition TVs and LED lighting all have to meet numerous conflicting requirements. Consumers long for slim yet high performing products. Therefore, manufacturers demand compact, cool and cost efficientsemiconductor solutions. These considerable space constraints can be resolved by reducing the size and weight of the components which occupy printed circuit board (PCB) area.
The worldwide smartphone market, for instance, is expected to grow by 9.4 percent year over year (2013 – 2018), according to Strategy Analytics (2014).
For chargers, there is a clear trend towards smaller, faster and more efficient solutions. With its height of only 1mm and with its very small footprint of 5mm x6 mm the ThinPAK 5×6 provides 80 percent volume reduction in comparison to traditional SMD packages such as DPAK.Thus, manufacturers gain flexibility for the design of even smaller chargers. The very low parasiticsof ThinPAK – such as low source inductance compared to the traditional DPAK – reduce the gate oscillation under all load conditions and minimize voltage overshoots during switching by 40 percent in comparison to traditional SMD thus improving device and system stability and ease of use.
The ThinPAK 5×6 guarantees engineers more flexibility in their PCB designs and betterswitching performance ultimately leading to more efficient power conversion while reducing overall system size in applications such as low power adapters, lighting and thin panel TVs.It follows the earlier release of the ThinPAK 8×8 which has meanwhile found excellent market adoption in higher power applications such as Server and Telecom SMPS.
