TE Connectivity (TE), a world leader in connectivity and sensors, introduced AMPMODU 2mm Board-to-Board receptacles which utilize phosphor bronze contacts with dual cantilever beams that are available in either gold or tin plating.
The dual-beam design provides for an increased contact surface between the header pin and the receptacle contact to allow reliable signal transfer. Housed in a high-temperature-resistant liquid crystal polymer (LCP) plastic, receptacles can applied in automated surface-mount, through-hole reflow (Pin-in-Paste) and traditional through-hole mount processes. The complete portfolio includes various top- and dual-entry vertical and horizontal receptacles that offer multiple options for Board-to-Board stacking of header and receptacle combinations.
As an authorized distributor for TE Connectivity, Heilind Asia provides TE’s products and also value added services. Heilind Asia supports both original equipment and contract manufacturers in all market segments of the electronics industry, stocking products from the industry’s leading manufacturers in 25 component categories, with a particular focus on interconnect, electromechanical, fastener/hardware and sensor products.