TE Connectivity Introduces the Chip Connect Cable Assemblies, the Chip Connect internal faceplate-to-processor cable assemblies enable Intel Omni-Path Architecture (OPA) by mating directly with LGA 3647 sockets at the processor and Intel Omni-Path Internal Faceplate Transition (IFT) connectors at the faceplate for 25 Gbps speeds.
Chip Connect cable assemblies reduce system design costs by eliminating the need to use costlier lower-loss PCB materials and retimes. With these interconnects, system design is made easier by reducing the complexity of PCB laminates and routing. These products are available in standard lengths and breakout configurations, but can be customized for specific applications. Take advantage of our broad range of high speed solutions such as Sliver connectors and STRADA Whisper connectors to create custom connections on the board or faceplate.
As authorized distributor for TE Connectivity, Heilind Asia provides TE products and also value added services. Heilind Asia supports both original equipment and contract manufacturers in all market segments of the electronics industry, stocking products from the industry’s leading manufacturers in 25 component categories, with a particular focus on interconnect and electromechanical products.
