TE Connectivity introduced industry-leading sliver straddle-mount connectors for SFF-TA-1002 are the new standard form factor supporting faceplate-pluggable Open Compute Project (OCP) NIC 3.0 applications and are one of the most cost effective and highest performing solutions on the market.
TE’s Sliver Straddle-Mount Connectors for SFF-TA-1002 enables OCP NIC 3.0 applications. Its faceplate-pluggable NIC cards are in a low profile for ease of system maintenance and improved thermal management. It supports high speeds though PCIe Gen 5, with a roadmap to 112G. The high-density, 0.6mm pitch of the Sliver straddle-mount connectors also supports next-gen silicon PCIe lane counts, which is where current products in the market begin to max out.
As an authorized distributor for TE Connectivity, Heilind Asia provides TE’s products and also value added services. Heilind Asia supports both original equipment and contract manufacturers in all market segments of the electronics industry, stocking products from the industry’s leading manufacturers in 25 component categories, with a particular focus on interconnect, electromechanical, fastener/hardware and sensor products.