New industrial CoolSiC™ MOSFETs 650 V G2 in Q-DPAK and TOLL packages offer improved power density
Munich, Germany – 12 February 2025 – The electronics industry is experiencing a significant shift towards more compact and powerful ...
Read moreMunich, Germany – 12 February 2025 – The electronics industry is experiencing a significant shift towards more compact and powerful ...
Read moreMunich, Germany – 12 March 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the new CoolSiC™ MOSFETs ...
Read moreMunich, Germany – 7 July, 2020 – From power lift gate and sunroof to electric seat adjustment and fuel pumps, ...
Read moreMunich, Germany – 30 June 2020 – Silicon carbide in electric vehicles stands for more efficiency, higher power density and ...
Read moreMunich, Germany, and El Segundo, California – 23 June 2020 – Reliably attaching surface mount hermetic power packages to PCBs ...
Read moreAdvanced design expected to see widespread adoption in the main drive inverters of EVs ROHM announces the cutting-edge 4th Generation 1200V SiC ...
Read moreJune 16, 2020 - STMicroelectronics’ VIPer222 controller for high-voltage converters up to 8W brings small size, low cost, and versatility to applications such ...
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