Great interest in new SIPLACE machines
Thanks to many new products from the areas of hardware, software and services, ASM Assembly Systems’ booth at the SMT Hybrid & Packaging 2013 scored high visitor numbers. The great interest was not only created by putting a focus on “SIPLACE solutions for the entire production workflow” – two new SIPLACE placement machines also were successfully unveiled this year. The new SIPLACE X3 S is the latest generation of the SIPLACE X high-end platform, while the SIPLACE D1i is a new solution for the more price-sensitive SMT production segment. Thus the SIPLACE team presented intelligent solutions from both ends of its product range. Gabriela Reckewerth, Director Global SIPLACE Marketing, was happy with the great response:
“On the first day already we had twice as many leads as on the corresponding day last year, and we continued with this streak until the last day. As always at the SMT, the discussions were very project-oriented. We are happy with this year’s show and are also looking forward to the Productronica in Munich where we will prove with new machines that we have succeeded in combining German Engineering with Asian Efficiency.”
Also new was the SIPLACE Very High Force Head for placement forces of up to 70 newtons. The SIPLACE team demonstrated its lead in the areas of software and workflow support in the four core processes NPI, setup concepts, material management and maintenance. Another machine by the SIPLACE mother ASM attracted lots of attention as well: With its MCM12, the European business unit ASM Back End Systems used the 2013 SMT Hybrid Packaging show to position itself as the world’s only supplier for frontend, backend and final assembly processes in the electronics industry.
>New placement machines for versatile electronics productions
With the SIPLACE X3 S, ASM Assembly Systems is rolling out the latest generation of its successful high-end platform. The new machine doesn’t just set new speed records, but is significantly more flexible than previous models, thanks to its interchange-able gantries that allow users to scale the machine’s performance in accordance with changing requirements. The very compact machine (1.9 x 2.6 meters) can handle PCBs with dimensions of up to 560 x 650 millimeters (W x L).
The SIPLACE D1i, on the other hand, is particularly interesting for the price-sensitive segment of the market and for electronics producers who are looking for an affordable yet technologically advanced placement solution as an addition to an existing SIPLACE line or an entry point into the SIPLACE world. The platform is also interesting because its software is compatible with the SIPLACE Pro station software, the SiCluster setup optimization software and many other market-leading SIPLACE software solutions.
For more information about the SMT Hybrid Packaging 2013 and the company, visit www.siplace.com/smtshow2013