At the JISSO Protec 2014 show being held at Tokyo’s Big Sight Exhibition Center June 4-6 2014, ASM Assembly Systems (East Hall 4, Booth No. 4C-04) is showcasing its world-leading platform for high-volume production, the SIPLACE X-Series. The highlight of the show is the live demonstration of the company’s placement technology for 0402 and 03015 components together with the innovative SIPLACE Glue Feeder solution, which dispenses adhesive and can be installed like any other feeder.
With 150,000 cph the SIPLACE X4i S is the world champion in benchmark placement performance. The SIPLACE X-Series, being the company’s flagship platform, is equipped with the latest technologies in terms of heads, feeders, vision systems and PCB transport. This makes it is also the best platform for 03015 placement applications. The new SIPLACE SpeedStar high-performance head with 20 nozzles operating in collect-and-place mode delivers top speed for standard components as small as 03015. With features such as online learning, programmable z-axis control and touchless pickup, SIPLACE delivers a smart placement process for such small components. Despite its unique flexibility, the new SIPLACE SpeedStar head achieves a benchmark speed rating of 37,500 cph with high accuracy. The SIPLACE X-Series is available with two, three and four gantries to deliver flexible and scalable performance for demanding production requirements.
Leading technologies
The highlight at the SIPLACE booth is the live demonstration of 01005 and 03015 component placements. Visitors are able to witness the advanced placement accuracy as well as the exceptional speed and innovative features of the SIPLACE X-Series with the SIPLACE SpeedStar head. The SIPLACE team is also demonstrating the innovative SIPLACE Glue Feeder, which gives electronics manufacturers a flexible way to glue components with ease and precision by applying glue dots directly to specific components. With the SIPLACE Glue Feeder, users achieve more production capacity and flexibility with less investment cost compared to expensive special glue stations.
Jack Chua, Chief Executive Officer of ASM Assembly Systems Singapore Pte Ltd, remarked: “We have seen that the Japanese electronics market is a pioneer in global market trends with innovative, advanced technologies. This kind of market needs continuous improvements in terms of speed, accuracy and flexibility. The SIPLACE team is the best partner to meet these demands. With our SIPLACE X-Series, we are proud to offer the leader in speed, accuracy and flexibility as well as 03015 components placement technology. We look forward to welcoming at our booth Japanese manufacturers who need the latest electronics technology.”
