· SST’s SuperFlash® Technology and GLOBALFOUNDRIES’ 55nm LPx provides low power and cost, high reliability, superior data retention and high-endurance performance customer solutions
· Optimized and silicon-proven Flash IP blocks available for various applications
· Growing customer traction for Smartcard, NFC, IoT, MCU and Automotive Grade 1 applications
New Delhi, May 15, 2015 — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, through its Silicon Storage Technology (SST) subsidiary, and GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today announced the full qualification and availability of SST’s 55nm embedded SuperFlash® non-volatile memory (NVM) on GLOBALFOUNDRIES’ 55nm Low Power Extended (LPx)/ RF enabled platform. The qualification of GLOBALFOUNDRIES’ 55nm, split-gate-cell SuperFlash technology-based process was performed according to JEDEC standards. This process technology also met the requirements of AEC-Q100 Grade 1 qualification with an ambient temperature range of -40°C to 125°C, and demonstrated endurance of 100K program/erase cycles with more than 20 years of data retention at 150°C.
According to global information company IHS, the automotive semiconductor market is forecast to reach $31B in 2015, with a strong 7.5 percent improvement over 2014. Embedded Flash-based semiconductors are a key component of this market segment.
“Embedded SuperFlash memory is a de-facto standard at foundries for microcontrollers, smartcards, and various system-on-chip devices,” said Mark Reiten, vice president of Technology Licensing for SST, a wholly owned subsidiary of Microchip. “GLOBALFOUNDRIES has been a great partner for building a state-of-the-art 55nm embedded SuperFlash platform, and we are already engaged with several customers in various market segments. We are pleased to partner with GLOBALFOUNDRIES, to further strengthen our market leadership in embedded Flash-based devices”.
“GLOBALFOUNDRIES recognizes the need to provide a low-cost embedded Flash platform for secure ID, mixed-signal, NFC/RF and next-generation IoT applications,” said Gregg Bartlett, senior vice president of product management at GLOBALFOUNDRIES. “Our deep collaboration with SST has resulted in qualified, commercially available 55nm SuperFlash technology on GLOBALFOUNDRIES’ high-yielding 55nm low-power process platform, which will enable high-performance solutions for customers across key market segments.”
GLOBALFOUNDRIES’ 55nm LPx/RF platform, complete with eNVM technology, is available to customers now. This platform technology offers a fast path-to-product solution, with a custom library of off-the-shelf eNVM IP blocks that are optimized for specific MCU product applications.
