Made of high quality heating material; de-soldering and soldering procedures of BGA are precisely controlled; Movable heating head, able to move freely horizontally;
Embedded industrial computer, PLC control, real-time profile display, able to display set profile and practically-tested profile; Big size operating touch screen ;
Profile saving no limit in this industrial computer, can analyze the two practically-tested profiles, The temperatures of the upper and lower hot air heaters can be precisely controlled according to their specific temperatures. The infrared constant temperature heating zone at the bottom area and the appropriate temperature-control settings make the rework safer and more reliable;
The supports for the BGA soldering supporting frame are micro-adjustable to restrain local sinkage; Powerful cross flow fans, cool the lower heating area rapidly;
The adjustable PCB positioning support, onto which the special fixtures for alloyed board could be installed, enables easy and fast positioning of the PCB board; Buzz after soldering is finished or de-soldering;
Hand vacuum pen is adjustable for removing BGA; Both the upper and lower parts are equipped with over-temperature alarming and protection apparatus; With different alloy hot gas nozzles makes easy to Solder and De-Solder the BGA�s. It could be tailored as per the specific requirements;
The software can be updated to auto-profile in future by USB, no need to set profiles.
For further details contact :
Kyoritsu Electric India Pvt. Ltd.
Ph : 0250 2024668 Fax : 0250 2471678
Kalpesh Sankhe : 9552597463
Vijay Shirodkar : 9552597464
E-mail ID : sales@kyoritsuelectric.co.in
