TORRANCE, CA — January 2016 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to introduce the MALCOM DS-10 Dip Tester. The tester provides data transmission to a PC by USB cable, creating a profile function. The dedicated software implements a high level of process management.
The created temperature profile makes it possible to monitor (50ms sampling rate) the temperature of the preheat and solder temperature sensors, in addition to the conventional management items. The system is equipped with a new Dip Time Sensor for accurate measurement. A heat-resistant cover for high-heat loads, such as Nitrogen ovens also is available as an option.