New Albany, IN: Samtec Inc., a privately held $822 MM global manufacturer of a broad line of electronic interconnect solutions, will showcase and demonstrate their latest high-performance interconnect and technologies at the PCI-SIG® Developers Conference Asia-Pacific Tour 2019.
Samtec high-speed technologies for Silicon-to-Silicon optimization will be on display, including new high-speed, high-bandwidth optical, board-to-board and cable-to-board interconnects. 56 Gbps PAM4 and 32 GT/s product demonstrations and technical sessions will also be highlighted.
Demonstrations:
- Scalable 32 GT/s Silicon Test Platform:
Demonstration of a configurable, next-generation GPU-based system combining cable mesh backplane (AcceleRate® Slim Body Cable Assemblies) and tradition two-connector backplane (next-generation Edge Rate® High-Speed Edge Card Connector) topologies. - Direct Connect Technology:
The demonstration platform showcases low latency, high performance, on-board optical engines transmitting at 56 Gbps PAM4 per channel. The Samtec FireFly™ Micro Flyover System™ copper and optical options offer a direct connection into the ASIC/FPGA package, bypassing the PCB for improved density and performance. The latest FireFly™ solutions are compatible with new generation FPGAs that support 56G PAM4 transceivers.
Technical Sessions (Taipei Location Only):
2:30 PM Tuesday, October 29, 2019 – Kevin Burt, Sr. Product Manager
- Enable PCI Express® (PCIe®) 5.0 Specification System Design with Ethernet Architectures:
As PCI Express specification data rates increase to 32 GT/s, system SI becomes critical. As other interfaces (Ethernet, InfiniBand, etc.) achieve higher data rates, opportunities exist to leverage industry-wide techniques that optimize power, thermal efficiency and cost-effectiveness across the system. Samtec will explore options enabling PCIe system architects to achieve similar results.
The demonstrations can be seen in the Samtec booth at PCI-SIG Developers Conference Asia-Pacific Tour 2019. The first location is the Westin Tokyo on October 23, 2019. The second location is the Taipei Marriott Hotel on October 28-29, 2019.
For more information on the Samtec High-Performance Interconnect Portfolio, please visit www.samtec.com/s2s or e-mail SIG@samtec.com.
