Partnership enables capacity assurance for energy-efficient silicon carbide power semiconductors
ROHM Semiconductor, an electronic parts manufacturer, and Vitesco Technologies, a leading international manufacturer of modern drive technologies and electrification solutions, today announced they have formed a long-term silicon carbide (SiC) supply partnership worth more than one billion U.S. dollars (2024 through 2030). The development partnership between the companies, which started in 2020, formed the basis for the supply partnership.
Vitesco Technologies’ advanced inverters with integrated ROHM SiC chips will be adopted by two customers, to be applied inside electric vehicle powertrains. Vitesco Technologies will start supplying a first series project as early as 2024, ahead of the originally targeted timeline.
SiC devices enable the design of particularly efficient power electronics, such as those needed for electric car inverters. SiC chips are a key technology, particularly for high voltages and for vehicles with demanding range targets and optimum overall efficiency. During the existing development partnership, with ROHM the relevant SiC chips were further optimized for use in automotive inverters starting in 2024.
“The supply partnership agreement with ROHM is an important building block for securing Vitesco Technologies’ SiC capacities in the years ahead,” said Andreas Wolf, CEO of Vitesco Technologies, at the signing ceremony in Regensburg, Germany. “We have had very good experience in our development cooperation so far and are now looking forward not only to continuing it, but also to intensifying it further,” adds Wolf.
“In the high-growth automotive market, SiC is a pathfinder for higher efficiency. With an expected higher market share of more than 30 percent, we are strongly positioned here and have gained a strategic partner in Vitesco Technologies for further market penetration,” said Dr. Kazuhide Ino, Member of the Board, Managing Executive Officer, and CFO of ROHM Co. Ltd., at the signing ceremony.
