Rochester Electronics selected as primary testing supplier by the Microelectronic Packaging organization within the Microsystems Engineering, Science and Applications (MESA) division at Sandia National Laboratories
Providing leading-edge semiconductor manufacturing services
NEWBURYPORT, MA – May 2021
Following the successful completion of an HBT (Heterojunction Bipolar Transistor) environmental and reliability (QCI) testing program in 2020, Rochester Electronics has been selected by the Microelectronic Packaging organization within the Microsystems Engineering, Science and Applications (MESA) division at Sandia National Labs (SNL) as one of its key external testing suppliers.
This organization within Sandia Labs is responsible for qualification testing of Application-Specific Integrated Circuits (ASIC) devices in applications such as sensors, photonics, and MEMS (MicroElectromechanical Systems) components.Sandia Labs is one of the key Federally Funded Research and Development Centers (FFRDC) protecting US national security and supporting numerous federal, state, and local government agencies, companies, and organizations.
Starting in July 2021, Rochester’s Engineering team will support SNL with environmental and reliability (QCI) testing of ceramic packages, specifically:
- 56CQFN ceramic package (Mil-Std-883 B&D testing)
- 56CQFN ceramic package (PIND, Fine/Gross Leak screen testing)
- 48CQFJ ceramic package (Mil-Std-883 B&D testing)
- 48CQFJ ceramic package (Fine/Gross Leak screen testing)
- 68CQFJ ceramic package (Mil-Std-883 B&D testing)
“We are delighted to be selected as a key supplierby Sandia National Labs. This program leverages Rochester’s strong reliability testing capabilities, both in terms of facilities and engineering skills, and we look forward to a long-term partnership.”
– Mike Dube,VP Manufacturing and Engineering, Rochester Electronics
