SAN JOSE, Calif., July 24, 2014—Cadence Design Systems, Inc., a leader in global electronic design innovation, announced that Renesas Electronics Corporation utilized the Cadence® QuickView Signoff Data Analysis Environment to achieve a 3X improvement in chip-finishing turnaround time over its previous solution. As a result of this productivity gain, Renesas has standardized on the Cadence® QuickView Signoff Data Analysis Environment to maximize tapeout productivityfor all technology nodes.
The QuickView Signoff Data Analysis Environment is a high-performance, high-capacity data-analysis tool that enables viewing and superimposing of design data in any of its intermediate conditions throughout the chip-finishing process. The QuickView Signoff Data Analysis Environment is also compatible with third-party IC implementation flows and can read file formats used by third-party verification tools. The solution’s comprehensive database operations—intelligent overlay, graphical XOR capabilities, synchronized multi-windows, net tracing, LEF/DEF support, merging/converting data, and cross-section views—make graphical comparisons of data easy by providing an additional element of decision support to tapeout engineers.
“After full-chip verification, opening the database for chip finishing can take hours, and because there are several iterations at this stage, any productivity loss has a large impact on time-sensitive project schedules and deadlines,” said Tatsuji Kagatani, department manager, Design Automation Department System Integration Business Division, Renesas Electronics Corporation. “We selected the QuickView Signoff Data Analysis Environment after a stringent evaluation, wherein Cadence delivered the best performance and capabilities. This enabled our design teams to improve their productivity and reduce iterations at tapeout.”
For more information on the QuickView Signoff Data-Analysis Environment, visit www.cadence.com/news/quickview
