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PCIM Europe: Toyochem to Feature Thermal Conductive Bonding Materials for Auto Electronics

Electronics Maker by Electronics Maker
April 25, 2023
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April 25, 2023, Tokyo, Japan—Toyochem Co., Ltd., the polymer materials division of Japan’s Toyo Ink Group, will be exhibiting its latest developments in thermal management materials for automotive electronic devices at Power Conversion and Intelligent Motion (PCIM) Europe 2023, an international trade fair dedicated to power electronics and its applications.

At this year’s show, Toyochem will be introducing sintering nano-silver pastes specially engineered as a bonding material in automotive power devices, a market for which demand is expected to grow. Toyochem’s proprietary nanoparticle design and dispersion technologies allow the formulation of silver pastes that not only demonstrate excellent printability and bonding reliability, but also thermoelectric conductivity of 300 W/m-K or higher. As such, they have proven effective as a thermal countermeasure and are currently being evaluated in Japan as a heat-dissipating material for automotive applications and for LED light sources. In addition, Toyochem nano-silver pastes can be customized to achieve dense bonding layers in both pressure and non-pressure sintering process for high bonding reliability.

PCIM Europe 2023 will take place at the Nuremberg Exhibition Center in Germany from May 9 to 11. For more information on the event, see https://pcim.mesago.com/nuernberg/en.html.

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