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Panasonic Industry Europe presents Advanced Technologies and Solutions for Automotive and Industrial Applications at PCIM 2019

Electronics Maker by Electronics Maker
April 25, 2019
in Electronics News
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Nextgen power electronics and automotive systems designed to increase reliability and reduce size will be revealed

syhMunich, April 2019: Panasonic Industry Europe (PIEU), the European supplier for automotive and industrial components and solutions presents its latest technology portfolio at PCIM, the power electronics exhibition on Booth 345, Hall 6 at the Nuremberg Messe from May 7th – 9th. Strong innovations in the fields of wide bandgap semiconductors, assembly technology and passive components technology form the basis of Panasonic unique position as the solution partner addressing the broadest range of challenges of the modern power electronic design.

Portfolio overview:

  • X-GaN™, new totem pole PFC and active clamp flyback reference designs
  • GaN bi-directional switches and 3 levels inverter
  • SiC modules and current sensors for xEV powertrain
  • Graphite based thermal interface materials
  • Hybrid and film capacitors, power choke coils
  • Polymer capacitors for energy storage

X-GaN™ transistors and new reference designs

Panasonic X-GaN™ transistors provide superior switching performance and high reliability and robustness, thanks to their fast switching, highly conductive structure that suppresses current collapse. These benefits are demonstrated in new reference designs of a 3kW totem pole PFC and of a 65W active clamped flyback AC adapter.

GaN bi-directional switches

Panasonic has developed a single chip GaN bi-directional switch capable of operating in 4 quadrants, by adopting an innovative dual gate device structure. This device enables a significant reduction of conduction losses and of the number of components needed in topologies such as multilevel inverters, matrix converters and Vienna rectifiers.

SiC modules for automotive

Panasonic range of low inductive power modules for xEV drivetrain embed Panasonic’s DioMOS (Diode-integrated) MOSFETs. The DioMOS structure enables a size reduction of SiC modules by integrated free-wheeling diode functionality inside the MOSFET.

Thermal interface materials (TIM)

GraphiteTIM is the next development step of the Pyrolytic Highly Oriented Graphite Sheet (PGS) portfolio. This PGS 100μm thin sheet acts as lightweight and easy to handle film with a thermal conductivity 700W/mK in plane and 26 W/mK out of plane. GraphiteTIM has been developed as a thermal interface material and boasts a high thermal conductivity of 28 W/mK which effectively disperses and transfers heat along X,Y and Z axis, provides better compressibility of 40%@600kPa pressure, easy handling and high reliability over the whole product life.

Passives – Hybrid and automotive film capacitors, power choke coils

Passive components on display feature Conductive Polymer Hybrid Aluminum Electrolytic Capacitors, which enable high power applications to achieve optimum performance through their low ESR, high ripple long life characteristics. Automotive film capacitors (AEC-Q200 compliant)- contribute to high safety & high reliability solution for a broad spectrum of application including automotive, industrial and renewable energy. Metal Composite Power Choke Coils offer a unique combination of features – high current capability, high reliability and good anti-vibration characteristics – which enable application design flexibility.

Energy polymer capacitors

Panasonic bridges the gap between batteries and super-capacitors with its newly developed Energy Polymer Capacitor reaching energy densities comparable to lead acid batteries while keeping the high power density of supercapacitors. Panasonic Energy Polymer Capacitor will enable new solutions for backup power, peak power assist and regenerative storage applications.

For further product information, please visit: http://industry.panasonic.eu

Tags: Automotive and Industrialdevices and modulesElectronic ComponentsMOSFETs
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