New Vishay Intertechnology Custom Substrates With Sidewall Patterning Increase Design Flexibility and Density
Thin Film Devices Accommodate Die Attach or Wire Bonding, Offer Line Width and Gap of ≥ 0.003 Inch and Tolerance...
Thin Film Devices Accommodate Die Attach or Wire Bonding, Offer Line Width and Gap of ≥ 0.003 Inch and Tolerance...
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