YAVNE, Israel, April 20, 2016 — ORBOTECH LTD. today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has received a repeat order from Huatian Technology (Kunshan) Electronics Co., Ltd for its Sigma fxP physical vapor deposition (PVD) systems. Huatian Technology, a subsidiary of the Chinese IC test and packaging services company, TianShui Huatian Technology Co., Ltd (TSHT), will deploy the additional Sigma fxP PVD systems to expand its existing capacity of 300mm packaging lines for under bump metallization (UBM) and CMOS image sensor (CIS) packaging services.
According to SEMI’s February 2016 report, China is the largest regional market for packaging equipment with 30% of global demand, and has grown at a CAGR of 19% over the past 10 years. In 2014, the Chinese government published the National Integrated Circuit Industry Development Promotion Summary, also known as the national “guideline.” One objective of the guideline is for China packaging technology to achieve world-class levels by 2020.
“China aims to be self-sustaining in ICs, with a goal of becoming 70% self-sufficient by 2025. As a result, significant investments are being made throughout the domestic supply chain,” stated Kevin Crofton, President of SPTS Technologies and Corporate Vice President at Orbotech. “With the purchase of these additional Sigma fxP PVD systems, Huatian is well positioned to meet the growing demand for wafer level packaging services from its global and domestic customers.”
Mr Aimo. Xiao, CEO of Huatian Technology (Kunshan) Electronics Co., Ltd stated, “To implement our growth plan, it is important to partner with suppliers such as Orbotech’s SPTS, which share our philosophy of technology innovation and success through the highest quality customer support. The Sigma fxP PVD system delivers first-class results at a low cost of ownership, which helps us remain cost competitive and grow our business. We look forward to working more closely with Orbotech-SPTS as we continue to build our 300mm packaging capabilities for the next phase of our growth.”
David Butler, Vice President of Product Management and Marketing at SPTS, will be giving an invited talk on PVD technologies on April 21st at the 2016 Symposium on Advanced Packaging and System Integration in Wuxi, China. This premier conference is hosted by Yole Développement and NCAP China, the National Centre for Advanced Packaging.
The SPTS 300mm PVD system for bumping applications comprises wafer degas, pre-clean and PVD modules for depositing UBM/RDL seed layers in advanced packaging schemes. Cost of ownership savings can exceed 30% through a unique approach to wafer degassing, a high rate pre-clean and long life targets and chamber furniture. The same PVD modules can also be used to deposit Ti-Cu seed or Thick Al alloy redistribution layers (RDL) in CIS wafer level packaging.
