The Nuvogo™ Fine targets a new PCB manufacturing industry standard for Advanced HDI and Flexible PCB Production of thinner devices
ORBOTECH LTD , a leading provider of process innovation technologies, solutions and equipment serving the global electronics manufacturing industry, today launched the Nuvogo Fine at JPCA 2016 in Tokyo, Japan. The Nuvogo Fine is specifically designed for new production methods and technologies, in particular for advanced high density interconnect (HDI), including modified semi-additive process (mSAP) and flexible printed circuits (FPC) at exceptionally high throughput on all types of resists. As the industry continues to move towards thinner, smarter and smaller devices and existing production technologies are reaching their limits, new production processes such as mSAP are enabling the high-volume manufacture of ultra-fine resolution printed circuit boards (PCB) to achieve superior imaging quality. This next-generation solution is designed to enable this process as the PCB manufacturing industry adapts to mSAP to tackle these upcoming challenges.
“As the industry moves toward wearables and smartphones with increasingly thinner form factors and higher functionality, HDI manufacturing processes must adapt in order to support this demand,” said Arik Gordon, Corporate Vice President and President of Orbotech’s PCB Division. “Orbotech’s quick response time to these changing dynamics, ensures our ability to stay at the forefront of PCB manufacturing. The Nuvogo Fine provides exceptional precision to support today’s advanced designs with streamlined production processes. This winning combination will, in turn, ensure that our customers stay ahead of the competition and answer designers’ needs with fast throughput, increased yield and lower total cost of ownership.”
