Carlsbad, CA, USA – February 2016 – Nordson YESTECH, a subsidiary of Nordson Corporation (NASDAQ: NDSN) and a leading supplier of automated optical and conformal coat inspection systems for the electronics industry announced today that they will launch their latest innovation in 3D inspection in Booth #1745at the IPC APEX EXPO, scheduled to take place in Las Vegas, USA from 15th – 17th March 2016.
The new FX-940 ULTRA 3D AOI incorporates cutting-edge 3D technology for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGA’s and other height sensitive devices. With its Advanced Fusion Lighting and comprehensive inspection tools including angled cameras, full-color digital image processing and both image and rule-based algorithms, the FX-940 ULTRA offers complete inspection coverage with unsurpassed 2D and 3D defect detection. The FX-940 ULTRA provides high-powered inspection with:
- 12 MP / 5 axis 3D NYTVISION Technology
- Complete 2D + 3D inspection capabilities
- 1 top-down and 4 side viewing cameras
- Automatic programming tools: < 30 minutes
- High defect coverage / low false failures
- SPC data collection & reporting
Don Miller, Nordson YESTECH’s Vice President commented, “Over the years, YESTECH has always delivered cutting edge inspection solutions, and we are excited to share our latest innovation in 3D inspection. Nordson YESTECH provides customers with technically advanced capabilities that no longer require the usual trade-offs between comprehensive inspection, speed and flexibility. We took a ‘no compromises’ approach with this product with the goal to provide the maximum performance and value for our customers.”
