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Home Electronics News

Nordson DAGE Awarded a Global Technology Award for Camera Assist Automatic Bondtesting at SMTA International

Electronics Maker by Electronics Maker
October 2, 2014
in Electronics News
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Second Award for this Core Application

Aylesbury, Buckinghamshire, UK — September 2014 — Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that it has been awarded a 2014 Global Technology Award for its Camera Assist Automatic Bondtesting. The award was presented to the company during a Tuesday, Sept. 30, 2014 ceremony that took place at the Donald Stephens Convention Center in Rosemont, IL during SMTA International.

nordson Camera Assist Automatic BondtestingBased upon a pedigree of automatic bond testing technology spanning more than two decades, Nordson DAGE has developed the latest camera assist automation as a feature of the award-winning 4000Plus bondtester platform.  Built around a unique multi-function cartridge, the camera assist automation system is ideally suited for applications such as pull and shear testing of wafer interconnections, lead frames, hybrid microcircuits or automotive electronic packages.  Easy programming using fiducial camera assist and vector stage nudge buttons provides precise X-Y alignment and facilitates rapid changeover for a variety of bond testing applications.

Nordson DAGE President, Phil Vere commented, “I’m very pleased to receive this award which reflects the progress at Nordson DAGE in this core application that will directly benefit customers.”

Premiering in 2005, the Global Technology Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts. For more information, visit www.globalsmt.net/awards.

For more information about Nordson DAGE, visit www.nordsondage.com.

Tags: EventsSMT Inspection
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