OSAKA, JAPAN —February 2016—Nihon Superior Co. Ltd., an advanced joining material supplier, will exhibit in Booth #2610 at the IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. The reliability of the company’s SN100C lead-free alloy has been proven in a wide range ofelectronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as inreflow.
During the show, the company will showcase newly developed products that offer solutions for some of the challenges the electronics industry is now facing, such as improvements in reliability, thermally stable joining, and lead-free die attach.
SN100CVTMP506 D4 is a lead-free,no-clean solder paste with its basic composition of (Sn-Cu-Ni+Ge+Bi). This new alloy has an additionthat enables thermally stable solder joints even after thermal cycling. Unlike silver-containing alloys that derive their strength from a dispersion of fine particles of eutectic Ag3Sn, SN100CV gains its strength from solute atoms in the tin matrix of the joint.The unique ability of SN100CVP506 D4 to survive long-term storage at room temperature allows simplification of stock management while meeting all the requirements of modern reflow soldering processes. The SN100CV alloy is also available as a completely halogen-free solder paste, SN100CV P604 D4 and a low residue paste, SN100CV P820-5 D4.
Alconano Nano-Silver Paste is based on a patented technology that makes it possible to effectively join most metals as well as Si and SiC at low sintering temperatures, if necessary in nitrogen, without the nitrous or sulphurous residues that are the by-products of the sintering of some other nano-silver pastes. The highly active surface of the nano-silver particles and the consequent strong capillary forces make it possible to achieve strong bonds even on copper with high electrical and thermal conductivity at low temperatures without the need for external pressure.
