OSAKA, JAPAN —August 2014—Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, will exhibit in Booth #410 at SMTA International, scheduled to take place Sep. 30 – Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.Company representatives will showcase a range of newly developed products that offer solutions for some of the challenges the electronics industry is now facing, including lead-free die attach, voidminimization, environmental protection and process yields.
The reliability of SN100C has been proven in a wide range of electronics assembly products. The SN100C alloy delivers a silver-free stable microstructure that can accommodate the long-term and impact strains to which a solder joint can be subjected. The eutectic character of the SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.
SN100C P506 D4 is a lead-free (Sn-Cu-Ni-Ge) no-clean solder paste that can be stored at room temperature for more than 150 days without deterioration. This new material will not only simplify stock management, but also improve productivity with excellent consecutive printability.
In the development of SN100C P604 D4 lead-free and completely halogen-free solder paste, Nihon Superior found a way of formulating a solder paste that complies with the requirement of the EU RoHS Directive.SN100C P604 D4 not use any chemicals requiring special registration under the EU REACH legislation without compromising performance and reliability. This ambitious goal was achieved by choosing a series of non-halogenated activators that are effective at each stage of the thermal profile commonly used with halogenated solder pastes.
SN100C (031) is a general purpose flux-cored lead-free solder wire that offers improved productivity. The alloy and cored flux combination provides excellent wetting for components with poor solderability.SN100C (031) solder wire provides fast wetting, resulting in faster soldering. In addition to highfirst pass yields offering good wetting and spread, SN100C (031) features low flux spattering, high insulation resistance and fast sequential soldering for high reliability and productivity.
Alconano Nano-Silver Paste is based on a patented technology that makes it possible to effectively join most metals as well as Si and SiC at low sintering temperatures, if necessary in Nitrogen, without the nitrous or sulphurous residues that are the by-products of the sintering of some other nano-silver pastes. The highly active surface of the nano-silver particles and the consequent strong capillary forces makes it possible to achieve strong bonds with high electrical and thermal conductivity at low temperatures without the need for external pressure.
For more information about Nihon Superior’s new solder pastes and lead-free products, meet company representatives in Booth #504 at the show or visit the company on the Web at www.nihonsuperior.co.jp/english.
