48 % RDS(on) improvement, increased power up to 300 W
Improved RDS(on) and current capability allows the LFPAK33 package to replace larger power styles at a lower cost with comparable product performance, where traditionally DPAK-packaged devices which are 80% larger than LFPAK33 devices have been used. Rugged, Trench 9 Superjunction technology also delivers a higher Avalanche capability and greater Safe Operating Area (SOA) for improved performance under fault conditions.
Comments Richard Ogden, Nexperia’s product manager: “Automotive design engineers continue to innovate – especially in applications such as water, fuel and oil pumps, and engine filters – focusing on reducing module size but with increasing power requirements. Our Trench 9 automotive LFPAK33 MOSFETs are a good fit for these thermally-demanding powertrain systems, since the unique LFPAK technology absorbs thermal stresses. Other automotive applications include parking brakes, airbag systems, LED Lighting, seat control & heating, window lift and driver infotainment systems.”
Nexperia’s LFPAK33 40 V MOSFET family represents the industry’s largest portfolio of devices in a 3×3 mm footprint, with an additional 16 Standard Level and Logic Level devices. Devices are qualified to AEC-Q101 exceeding the requirements of this standard by more than two times. More information on the new low RDS(on) 40 V MOSFETs, including product specs and datasheet is available at https://efficiencywins.nexperia.com/efficient-products/lfpak33-drives-300-watt-powertrain-systems.html
