Electronics news & updates

Munich, Germany – 24 April 2025 – When developing applications for autonomous driving, compliance with the ISO 26262 standard is crucial – at both the system and sensor levels. To meet these demands, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the XENSIV™ TLE4960x magnetic switch family. Developed in accordance with ISO 26262, the TLE4960x switches integrate diagnostic functions to support functional safety applications with requirements up to ASIL B. They are the only ASIL-B-compliant switches on the market that can address a wide range of automotive applications, including window regulators, sunroof actuators, and seat adjustment. In addition, the devices are AEC-Q100 compliant and qualified to Grade 0, ensuring robust performance in harsh environments.

The TLE4960x devices are designed to measure the magnetic field orthogonal to the printed circuit board in the Z-direction and feature an open-drain output for speed information. They also include integrated overcurrent and overtemperature protection. Housed in a standardized SOT23-3 SMD package, the sensors require only 1.6 mA and operate across an extended temperature range from -40°C to 175°C. Their excellent temperature stability makes them ideal for harsh automotive environments.

Availability

The XENSIV TLE4960x magnetic switch family can be ordered now. Further information is available at www.infineon.com/magnetic-switches. 

Transaction will augment Cadence’ s expanding design IP portfolio and accelerate growth opportunities

National, April 2025: Cadence (Nasdaq: CDNS) today announced that it has entered into a definitive agreement with Arm (Nasdaq: ARM) to acquire Arm’s Artisan foundation IP business, consisting of standard cell libraries, memory compilers, and general-purpose I/Os (GPIOs) optimized for advanced process nodes at the leading foundries. The transaction will augment Cadence’s expanding design IP offerings, anchored by a leading portfolio of protocol and interface IP, memory interface IP, SerDes IP at the most advanced nodes, and embedded security IP from the pending Secure-IC acquisition.

By increasing its footprint in SoC designs, Cadence is reinforcing its commitment to continuously accelerate customers’ time to market and to optimize their cost, power and performance on the world’s leading foundry processes. Cadence will acquire the Arm Artisan foundation IP business through an asset purchase agreement with a concurrent technology license agreement, to be signed at closing and subject to any existing rights. As part of the transaction, Cadence will acquire a highly talented and experienced engineering team that is well respected in the industry and can help accelerate development of both related and new IP products.

“During its 25-year history, Arm’s Artisan IP has established a strong presence and reputation in the global ecosystem of foundries and SoC partners. With the expected addition of the Artisan IP business and team, Cadence will enter the foundation IP market, enabling us to capitalize on new growth opportunities,” said Boyd Phelps, senior vice president and general manager of the Silicon Solutions Group at Cadence. “In doing so, we will gain key technology and expertise to augment our design services and chiplet offerings, enabling us to deliver on our comprehensive IP strategy and provide greater value to our customers. By leveraging the full Cadence stack of IP, libraries, tools, and services, we strive to improve PPA while growing this foundation IP business.”

“We are committed to ensuring that the foundational physical IP needed to deploy Arm technology across all markets continues to be available to the ecosystem,” said Kevork Kechichian, executive vice president, Solutions Engineering, Arm. “The Artisan brand is well established and we believe this technology will continue to play a significant role in the semiconductor industry in the future, and that Cadence is an ideal partner to take it forward.”

The transaction is anticipated to close in the third quarter of 2025, subject to receipt of regulatory approvals and other customary closing conditions. The acquisition is expected to be immaterial to revenue and earnings this year.

Indium Corporation® was pleased to welcome U.S. Congressman John W. Mannion (NY-22) to its Business Park Drive facility in Utica, New York, for a site visit showcasing the company’s global leadership in critical materials, its commitment to strengthening the domestic semiconductor supply chain, and its dedication to workforce development and U.S. manufacturing competitiveness.

As a former state senator and educator, Congressman Mannion has consistently supported efforts to strengthen workforce development, education, and economic growth throughout New York State. Indium Corporation appreciates his leadership and continued efforts to promote advanced manufacturing, education, workforce development, and job growth across the region.

During his visit, Congressman Mannion met with Indium Corporation executives and team members for a guided tour of the company’s Business Park Drive facility. The site houses specialized manufacturing operations and serves as a hub for innovation, process improvement, and employee training initiatives—including the work of the engineering team to develop precision solder preforms for advanced semiconductor applications.

“As a leader in materials science, Indium Corporation is proud to host Congressman Mannion and showcase the important work being done here in the Mohawk Valley to help strengthen global supply chain diversity and stability and support our facilities in the United States,” said Ross Berntson, President and CEO of Indium Corporation. “Congressman Mannion’s background in education and workforce issues aligns with our core values as a company that invests in people as much as we invest in technology.”

A key focus of the visit was Indium Corporation’s ongoing leadership in the sourcing, refining, and distribution of critical materials such as gallium and indium. These materials play an essential role in advanced electronics, semiconductor devices, 5G technologies, photovoltaics, and emerging AI applications. By leading research and commercialization efforts for gallium and indium, Indium Corporation is committed to building a robust supply chain for our global customers.

In addition, Congressman Mannion learned more about Indium Corporation’s suite of employee-focused workforce development programs, which support continuous learning and career advancement across all levels of the company. The programming includes STEM outreach, job shadowing, summer internships, registered apprenticeships, Real Life Rosies, and Advance to Apprenticeships engagements, ELL (English Learning Language), financial literacy, and materials science classes, skills building, operational excellence, and leadership development.

“We believe in creating opportunities for people to build meaningful, long-term careers,” said Dawn Roller, Associate Vice President of Human Resources at Indium Corporation. “Whether someone is just entering the workforce, looking to grow into a new role, or gain mastery in their chosen field, our programs are designed to support their development every step of the way.”

Congressman Mannion’s visit is part of Indium Corporation’s ongoing effort to engage with policymakers, industry stakeholders, and community leaders to support initiatives that drive innovation, economic growth, and inclusive opportunity in Central New York and beyond. As a company that believes materials science changes the world, Indium Corporation is committed to advancing technologies and partnerships that shape a more connected, sustainable future.

THIEF RIVER FALLS, Minnesota, USA – DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, is proud to announce the expansion of its extensive product selection in Q1 2025. This includes the addition of 104 new suppliers and 98,320 innovative new product introductions (NPIs) in the first quarter across its core business, Marketplace and Fulfilled by DigiKey programs.

“We are thrilled to keep adding cutting-edge suppliers and products to our line card to offer engineers and innovators all the parts and solutions they need for everything they design,”said Mike Slater, vice president of global business development for DigiKey. “The notable additions we made to our product and supplier portfolios in the first three months of this year are directly linked to the strong customer activity we experienced in the first quarter, and we’re excited to continue welcoming more NPIs and leading suppliers to the DigiKey family this year.”

The most recentnew supplier additions in the first quarter include companies like Cookiecad, which produces 3D printing filament in a wide array of colors and materials; DB Products, a leading manufacturer of microphones, transducers and receivers; Electro Terminal, which produces drivers and electromechanical solutions for lighting applications; and MinewSemi, a leading provider of IoT wireless connectivity modules for applications in smart buildings, smart agriculture, consumer electronics and more.

Some of the NPIs added in the first quarter of 2025 include:

•             SICK’s microScan safety laser scanner which can operate successfully even in stressful conditions such as weld sparks, ambient light or dust.

•             Chip Quik’s ESD silicone soldering mats provide spacious work space, include compartments for components, and come in ten different color options.

•             TDK’s FS160* series of microPOL (μPOL) power modules integrate a controller, driver, MOSFETs and a logic core into a compact solution that provides full telemetry (voltage, current and temperature).

•             Murata Electronics’ SCH16T-K01 inertial sensor features a gyroscope andaccelerometer — eliminating the need for extensive calibration at the user’s end and making it ideal for industrial applications.

•             Infineon Technologies’PSoC control C3M5 evaluation kitenables real-time control and increased system efficiency of motor control and power conversion applications.

•             NXP Semiconductors’FRDM-IMX93 entry-level development board equipped with NXP's Tri-Radio solution with Wi-Fi + Bluetooth is ideal for developing modern industrial and IoT applications that require AI acceleration and advanced security.

•             Silicon Labs’MG26 multiprotocol wireless SoC, BG26 Bluetooth SoC, and PG26 MCU development products solve diverse IoT designs based on the user’s preference for different protocols, energy efficiency and wireless performance needs.

•             PUI Audio’s medical audio indicators simplify the design of medical applications by providing three different tone frequency options in one IEC 60601-1-8 compliant audio device.

As the leading global provider of high-service distribution of electronic components and automation products, DigiKey is thrilled to continue delivering an unmatched selection of products to accelerate progress for every designer, buyer and builder.

For more information about the suppliers and products in DigiKey’s portfolio, visit DigiKey.com.

STMicroelectronics Reports 2025 First Quarter Financial Results

• Q1 net revenues $2.52 billion; gross margin 33.4%; operating income $3 million; net income $56 million
• Business outlook at mid-point: Q2 net revenues of $2.71 billion and gross margin of 33.4%
• Company-wide program to reshape manufacturing footprint and resize global cost base on track; annual cost savings target in the high triple-digit million-dollar range exiting 2027 confirmed.

April 24, 2025 – STMicroelectronics N.V. (“ST”) (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, reported U.S. GAAP financial results for the first quarter ended March 29, 2025. This press release also contains non-U.S. GAAP measures (see Appendix for additional information).

ST reported first quarter net revenues of $2.52 billion, gross margin of 33.4%, operating income of $3 million and net income of $56 million or $0.06 diluted earnings per share.

Jean-Marc Chery, ST President & CEO, commented:

• “Q1 net revenues came in line with the midpoint of our business outlook range, driven by higher revenues in Personal Electronics offset by lower-than-expected revenues in Automotive and Industrial. Gross margin was slightly below the mid-point of our business outlook range mainly due to product mix.”
• “On a year-over-year basis, Q1 net revenues decreased 27.3%, operating margin decreased to 0.1% from 15.9% and net income decreased 89.1% to $56 million.”
• “In the first quarter, our book-to-bill ratio improved with both Automotive and Industrial above parity.”
• “Our second quarter business outlook, at the mid-point, is for net revenues of $2.71 billion, decreasing year-over-year by 16.2% and increasing sequentially by 7.7%; gross margin is expected to be about 33.4%, impacted by about 420 basis points of unused capacity charges.”
• “We plan to maintain our Net Capex (non-U.S. GAAP¹) plan for 2025 between $2.0 billion and $2.3 billion mainly to execute the reshaping of our manufacturing footprint.”
• “While we see Q1 2025 as the bottom, in the current uncertain environment we are focusing on what we can control: keep on innovating to continuously improve and accelerate the competitiveness of our product and technology portfolio, focus on advanced manufacturing and tightly manage our costs. In this respect our company-wide program to reshape ST manufacturing footprint and resize our global cost base is on track and we confirm the annual cost savings target in the high triple-digit million-dollar range exiting 2027.”

Quarterly Financial Summary

First Quarter 2025 Summary Review

ST made some adjustments to its segment reporting effective starting January 1, 2025. Prior year comparative periods have been adjusted accordingly. See Appendix for more detail.

Net revenues totaled $2.52 billion, representing a year-over-year decrease of 27.3%. Year-over-year net sales to OEMs and Distribution decreased 25.7% and 31.2%, respectively. On a sequential basis, net revenues decreased 24.2%, 20 basis points better than the mid-point of ST’s guidance.

Gross profit totaled $841 million, representing a year-over-year decrease of 41.7%. Gross margin of 33.4%, 40 basis points below the mid-point of ST’s guidance, decreased 830 basis points year-over-year, mainly due to product mix and, to a lesser extent, higher unused capacity charges and lower sales price.

Operating income decreased 99.5% to $3 million, compared to $551 million in the year-ago quarter. ST’s operating margin decreased 1,580 basis points on a year-over-year basis to 0.1% of net revenues, compared to 15.9% in the first quarter of 2024. Excluding Impairment, restructuring charges and other related phase-out costs³, operating income stood at $11 million in the first quarter.

By reportable segment, compared with the year-ago quarter:

In Analog, Power & Discrete, MEMS and Sensors (APMS) Product Group:

Analog products, MEMS and Sensors (AM&S) segment:

• Revenue decreased 23.9% mainly due to a decrease in Analog.   
• Operating profit decreased by 66.7% to $82 million. Operating margin was 7.7% compared to 17.5%.

Power and Discrete products (P&D) segment:

• Revenue decreased 37.1%.
• Operating profit decreased from a positive $77 million to a negative $28 million. Operating margin was -6.9% compared to 12.1%.

In Microcontrollers, Digital ICs and RF products (MDRF) Product Group:

Embedded Processing (EMP) segment:

• Revenue decreased 29.1% mainly due to a decrease in GPAM.
• Operating profit decreased by 71.5% to $66 million. Operating margin was 8.9% compared to 22.2%.

RF & Optical Communications (RF&OC) segment:

• Revenue decreased 19.2%.
• Operating profit decreased by 59.0% to $43 million. Operating margin was 13.9% compared to 27.4%.

Net income and diluted Earnings Per Share decreased to $56 million and $0.06 respectively compared to $513 million and $0.54 respectively in the year-ago quarter. Excluding Impairment, restructuring charges and other related phase-out costs net of the relevant tax impact, Net income and diluted Earnings Per Share² stood at $63 million and $0.07 respectively in the first quarter of 2025.

Cash Flow and Balance Sheet Highlights

Net cash from operating activities was $574 million in the first quarter compared to $859 million in the year-ago quarter.

Net Capex (non-U.S. GAAP), was $530 million in the first quarter compared to $967 million in the year-ago quarter.

Free cash flow (non-U.S. GAAP) was positive at $30 million in the first quarter, compared to negative $134 million in the year-ago quarter.

Inventory at the end of the first quarter was $3.01 billion, compared to $2.79 billion in the previous quarter and $2.69 billion in the year-ago quarter. Days sales of inventory at quarter-end was 167 days, compared to 122 days for both the previous quarter and the year-ago quarter.

In the first quarter, ST paid cash dividends to its stockholders totaling $72 million and executed a $92 million share buy-back, as part of its current share repurchase program.

ST’s net financial position (non-U.S. GAAP⁴) remained strong at $3.08 billion as of March 29, 2025, compared to $3.23 billion as of December 31, 2024 and reflected total liquidity of $5.96 billion and total financial debt of $2.88 billion. Adjusted net financial position (non-U.S. GAAP¹), taking into consideration the effect on total liquidity of advances from capital grants for which capital expenditures have not been incurred yet, stood at $2.71 billion as of March 29, 2025.

Corporate developments

On April 10, 2025, ST detailed its company-wide program to reshape manufacturing footprint and resize global cost base and confirmed the annual cost savings target in the high triple-digit million-dollar range exiting 2027. Specifically, ST disclosed further elements of its program to reshape its global manufacturing footprint.

Business Outlook

ST’s guidance, at the mid-point, for the 2025 second quarter is:

• Net revenues are expected to be $2.71 billion, an increase of 7.7% sequentially, plus or minus 350 basis points.
• Gross margin of 33.4%, plus or minus 200 basis points.
• This outlook is based on an assumed effective currency exchange rate of approximately $1.08 = €1.00 for the 2025 second quarter and includes the impact of existing hedging contracts.
• The second quarter will close on June 28, 2025.

This business outlook does not include any impact for potential further changes to global trade tariffs compared to the current situation.

Conference Call and Webcast Information

ST will conduct a conference call with analysts, investors and reporters to discuss its first quarter 2025 financial results and current business outlook today at 9:30 a.m. Central European Time (CET) / 3:30 a.m. U.S. Eastern Time (ET). A live webcast (listen-only mode) of the conference call will be accessible at ST’s website, https://investors.st.com, and will be available for replay until May 9, 2025.

Use of Supplemental Non-U.S. GAAP Financial Information

This press release contains supplemental non-U.S. GAAP financial information.

Readers are cautioned that these measures are unaudited and not prepared in accordance with U.S. GAAP and should not be considered as a substitute for U.S. GAAP financial measures. In addition, such non-U.S. GAAP financial measures may not be comparable to similarly titled information from other companies. To compensate for these limitations, the supplemental non-U.S. GAAP financial information should not be read in isolation, but only in conjunction with ST’s consolidated financial statements prepared in accordance with U.S. GAAP.

See the Appendix of this press release for a reconciliation of ST’s non-U.S. GAAP financial measures to their corresponding U.S. GAAP financial measures.

New Hyde Park, NY… Keystone Electronics offers a complete line of LED Spacer Mounts for T-1 and T-1 ¾ LEDs including Universal, Self-Aligning and Cost Saving, Self-Retaining configurations.

Engineered to reduce assembly cost and ensure consistently uniform and perpendicular LED mounting.  Keystone’s Self-Retaining LED Spacer Mounts are designed with internal retaining teeth to hold and secure LED leads onto spacer prior to PCB assembly.  No special tools are necessary to pre-assemble LED to spacer.  These Spacer Mounts also eliminate the possibility of shorting LED leads by separating and retaining component leads while inserting into PCB.  

These spacers are molded from Nylon 6/6 material in heights from 0.120” to 0.925” (3.04mm to 23.49mm).  0.020” (0.5mm) legs lift the mount off the PCB to serve the dual purpose of heat dissipation and post solder clean-up.  Keystone also offers a series of “Universal” and “Self-Aligning” LED Spacer Mounts that accommodate both Tri-Lead and Bi-Lead T-1 & T-1 ¾ LEDs.  All products are available through Keystone’s global distribution network and online.

Keystone Electronics Corp. offers a comprehensive line of interconnect components and electronic hardware.  Modifications, special designs, stamping, machining, assembly services and application-engineering support are also available.

Keystone is ISO 9001:2015 certified, with headquarters in the US and global offices in Europe, Canada, Asia and Australia.  For complete product catalog, details and specifications contact Keystone Electronics Corp., 55 South Denton Ave., New Hyde Park, NY 11040; Tel: (800) 221-5510 or (516) 328-7500; Fax: (516) 328-1080; E-mail: kec@keyelco.com; website: www.keyelco.com.

Munich, Germany – 22 April 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a global semiconductor leader in power systems and IoT, and Marelli, a world-leading automotive systems manufacturer, are partnering to advance automotive display technology with an innovative MEMS laser beam scanning (LBS) system. Based on Infineon’s LBS technology, this solution enables Marelli to create immersive cockpit experiences free from the constraints of traditional displays. This cutting-edge technology will be showcased at Marelli's booth during Auto Shanghai 25.

“The automotive industry's demand for innovative optics solutions in cockpit designs is accelerating, and Infineon is committed to delivering these solutions to our customers faster than ever before,” said Dr. Thomas Schafbauer, Head of Sensor and RF Business Unit at Infineon. “With our focus on a faster time to market, we're helping our customers stay ahead of the curve and capitalize on the growing demand for next-generation display technologies.”

“We are thrilled to collaborate with Infineon on MEMS LBS, which represents a significant leap in automotive display technology,” said Joachim Fetzer, Chief Technology and Innovation Officer at Marelli. “This innovative solution offers significant design freedom and efficiency, enabling us to create unique and engaging cockpit experiences for our customers with a faster innovation-to-customer approach.”

The Infineon MEMS LBS system is fully automotive-compliant. It is shock and vibration robust, and compliant up to ASIL-B. Its compact chip-scale package ensures versatility and enables flexible design possibilities for easy integration across various applications. Furthermore, the system's high efficiency provides a bright, clear display even in high ambient light conditions and reduces power consumption and heat generation, making it highly suitable for demanding automotive environments. A large depth of field also offers focus-free projection, simplifying the optical design. These features allow OEMs to differentiate their cockpit designs while maintaining rich information displays.

The Infineon MEMS LBS system will be showcased at Marelli's booth (Hall 1.2H, booth 1BF009) during Auto Shanghai 25.

Munich, Germany – 16 April 2025 – The market for electric vehicles continues to gather pace with a strong volume growth of both battery electric vehicles (BEVs) and plug-in hybrid electric vehicles (PHEVs). The share of electric vehicles produced is expected to see double-digit growth by 2030 with a share of around 45 percent compared to 20 percent in 2024 [1]. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is responding to the growing demand for high-voltage automotive IGBT chips by launching a new generation of products. Among these offerings are the EDT3 (Electric Drive Train, 3 ^rd generation) chips, designed for 400 V and 800 V systems, and the RC-IGBT chips, tailored specifically for 800 V systems. These devices enhance the performance of electric drivetrain systems, making them particularly suitable for automotive applications.

The EDT3 and RC-IGBT bare dies have been engineered to deliver high-quality and reliable performance, empowering customers to create custom power modules. The new generation EDT3 represents a significant advancement over the EDT2, achieving up to 20 percent lower total losses at high loads while maintaining efficiency at low loads. This achievement is due to optimizations that minimize chip losses and increase the maximum junction temperature, balancing high-load performance and low-load efficiency. As a result, electric vehicles using EDT3 chips achieve an extended range and reduce energy consumption, providing a more sustainable and cost-effective driving experience.

“Infineon, as a leading provider of IGBT technology, is committed to delivering outstanding performance and reliability”, says Robert Hermann, Vice President for Automotive High Voltage Chips and Discretes at Infineon Technologies. “Leveraging our steadfast dedication to innovation and decarbonization, our EDT3 solution enables our customers to attain ideal results in their applications.”

The EDT3 chipsets, which are available in 750 V and 1200 V classes, deliver high output current, making them well-suited for main inverter applications in a diverse range of electric vehicles, including battery electric vehicles, plug-in hybrid electric vehicles, and range-extended electric vehicles (REEVs). Their reduced chip size and optimized design facilitate the creation of smaller modules, consequently leading to lower overall system costs. Moreover, with a maximum virtual junction temperature of 185°C and a maximum collector-emitter voltage rating of up to 750 V and 1200 V, these devices are well-suited for high-performance applications, enabling automakers to design more efficient and reliable powertrains that can help extend driving range and reduce emissions.

“Infineon, as Leadrive's primary IGBT chip supplier and partner, consistently provides us with innovative solutions that deliver system-level benefits,” said Dr. Ing. Jie Shen, Founder and General Manager of Leadrive. “The latest EDT3 chips have optimized losses and loss distribution, support higher operating temperatures, and offer multiple metallization options. These features not only reduce the silicon area per ampere, but also accelerate the adoption of advanced packaging technologies.”

The 1200 V RC-IGBT elevates performance by integrating IGBT and diode functions on a single die, delivering an even higher current density compared to separate IGBT and diode chipset solutions. This advancement translates into a system cost benefit, attributed to the increased current density, scalable chip size, and reduced assembly effort.

Infineon’s latest EDT3 IGBT chip technology is now integrated into the HybridPACK™ Drive G2 automotive power module, delivering enhanced performance and capabilities across the module portfolio. This module offers a power range of up to 250 kW within the 750 V and 1200 V classes, enhanced ease of use, and new features such as an integration option for next-generation phase current sensors and on-chip temperature sensing, contributing to system cost improvements.

All chip devices are offered with customized chip layouts, including on-chip temperature and current sensors. Additionally, metallization options for sintering, soldering and bonding are available on request.  

Availability

The new EDT3 and RC-IGBT devices are already available for sampling. Further information is available at www.infineon.com/edt3 .