Electronics news & updates

Mumbai, August 5^th, 2025: Rashi Peripherals Limited (NSE: RPTECH) (BSE: 54419), one of the leading ICT distribution partners for global technology brands in India, reported a 12% YoY increase in Profit After Tax (PAT) at ₹617 million, driven by healthy margins and operational efficiencies. Revenue stood at ₹31,521 million, while EBITDA grew 23% YoY to ₹1,114 million, reflecting improved cost discipline and a better mix of high-margin segments.

Key Consolidated Financials:

* excluding last year’s on-of AI Server deal, revenue grew by 11.4% YoY

Operational Updates:

• Q1 FY26 recorded 11.4% Y-o-Y growth excluding projects business 
• Operational efficiencies help report strong EBITDA Margin of 3.53%, up around 140 basis points
• Participated in 15th CHANNEL BUSINESS FORUM - longest running channel roadshow in India
• Surveillance business grew multiple times
• Increasing penetration in AI solutions business
• 4 new Brands added in the Brand Portfolio

Commenting on the performance, Mr. Kapal Pansari, Managing Director, Rashi Peripherals Limited said, “We are extremely pleased with our robust performance in Q1 FY26, building strongly on the growth momentum we established in FY25. The PES segment has demonstrated particularly impressive growth, reflecting resilient demand across personal computing and ICT peripherals. Our strategic focus on integrating AI solutions into our offerings is already delivering meaningful results, positioning us at the forefront of this transformative shift. Our market expansion strategy for FY2025 remains well on track, supported by a diversified brand portfolio that caters to various market and industry segments. This unique combination distinguishes us in the Indian ICT industry. Our efforts this quarter underscore our commitment to delivering sustained value and reinforcing our leadership in the ICT distribution space, while contributing meaningfully to the government’s Digital Bharat vision.”

Mr. Rajesh Goenka, Chief Executive Officer, Rashi Peripherals Limited said, "We closed Q1 FY26 with expanding EBITDA margins, reflecting our continued commitment to operational excellence. This improvement is a direct result of process optimization and disciplined cost management across the board. Our surveillance business, in particular, witnessed encouraging growth, driven by increasing demand for advanced security solutions. We remain deeply engaged with our channel partners through initiatives like CBF 2025, the longest-running channel partner meet in India. Through this platform, we not only strengthen our relationships but also unlock new growth opportunities, especially in Tier-2 and Tier-3 cities. Our resilient and diversified distribution model has delivered 11.4% revenue growth, excluding the project business."   

Recognizes DigiKey’s outstanding partnership at the high service level

THIEF RIVER FALLS, Minnesota, USA – DigiKey, the leading global electronic components and automation products distributor, has received the Distribution Excellence 2025 High Service Level Award from Sensirion. DigiKey was selected for this honor based on its global customer count and revenue growth metrics.

DigiKey and Sensirion leadership teams celebrate DigiKey receiving the 2025 Distribution Excellence Award – High Service Level from Sensirion. Pictured from left to right: Gina Greco,  Sean Sorteberg, Jason Gums, Diane Haynes and Andres Laib.

The award was presented at Sensirion's EMEA distribution meeting in June, hosted in Switzerland. DigiKey team members from North America and Europe accepted the award in person.

“We’re honored to receive Sensirion’s Global High Service Distribution Excellence Award,” said Jason Gums, supplier business development manager for DigiKey. “This recognition reflects the strength of our partnership, our spirit of collaboration and our shared commitment to delivering exciting new product introductions to customers around the world.”

“We’re delighted to present DigiKey with the 2024/2025 Global Distribution Excellence Award in the High Service Level category,” said Gina Greco, director, channel sales for Sensirion.” Their commitment to growing our customer community, bringing new products to the spotlight and delivering strong revenue growth has truly stood out across our international network.”

Sensirion is the leading manufacturer of high-quality sensors and sensor solutions for the measurement and control of humidity, and of gas and liquid flows worldwide. Sensirion and DigiKey have been strategic partners since 2016. For more information about Sensirion and to order from its product portfolio, visit the DigiKey website.

New Delhi, 4th August, 2025: – India Cellular and Electronics Association (ICEA) called for the urgent need to prioritize industrial and infrastructure electronics as a central pillar of India’s $500 billion electronics manufacturing target by 2030-31. The future of India’s electronics industry doesn’t lie only in the manufacturing of products, it lies in the manufacturing of goods which will automate our factories, cities, and transportation networks. Industrial electronics must be brought to the heart of India’s electronics growth strategy.

Mr. Pankaj Mohindroo, Chairman, ICEA, stated: “The industrial electronics segment must be recognized as a national strategic priority. It is the brain and nervous system of every advanced manufacturing setup. Without leadership in industrial automation, India cannot claim true manufacturing leadership.”

Mr. Mohindroo, further noted that industrial electronics has massive potential for high-skilled employment, particularly in areas such as embedded systems, automation software, robotics, and AI-integrated systems. And we must invest in talent pipelines, R&D, and incentives to grow this sector. India should aim to become not just a user of industrial electronics, but a global design and manufacturing hub for it.”

On this Industrial growth, Mr. Manish Walia, VP, Delta Electronics said, “The industrial electronics forms the technological backbone of modern manufacturing infrastructure, powering smart factories, robotics, intelligent grids, automated systems, and future-ready transport and logistics networks. Industrial electronics is not a vertical in itself, rather it is a horizontal which drives all verticals/sectors of manufacturing.”

ICEA is currently leading efforts to craft a dedicated policy and strategic roadmap for industrial electronics through its Steering Committee on Industrial Electronics and Infrastructure, this is being done in close collaboration with the government and leading industry stakeholders. The steering committee has top leaders from Delta Electronics, Infineon Technologies, Festo, Fanuc, Rockwell Automation India Pvt. Ltd, Feedback Advisory and Federation for Economic Development (FED), will come out in the form of a detailed market study highlighting the challenges related to technology access, regulatory frameworks, and ecosystem development to position India as a global force in industrial electronics. 

In a major boost to India’s capabilities in this sector, Amber Enterprises India Ltd. has recently acquired a controlling stake in Israel-based Unitronics (1989) (R”G) Ltd, a global leader in industrial automation, through its subsidiary ILJIN Electronics India Pvt Ltd. This strategic ₹404 crore acquisition enhances India’s access to world-class industrial automation technologies and aligns with national priorities on self-reliance, export competitiveness, and high-value job creation. Unitronics brings with it cutting-edge capabilities in Programmable Logic Controllers (PLCs), Human-Machine Interfaces (HMIs), Variable Frequency Drives (VFDs), and Industrial IoT, all of which are key enablers of Industry 4.0. 

Mr. Jasbir Singh, Executive Chairman and CEO of Amber Group, said: “This transaction will significantly strengthen India’s Industrial automation by providing a strong foothold in the rapidly growing sector of Industry 4.0 solutions and real-time data-driven technologies. “This will accelerate our nation's transition towards smart factories and digitally-driven production systems, ultimately supporting the goal of Atmanirbhar Bharat in high-tech manufacturing,” Mr. Singh added. 

The Industrial automation technologies enhance productivity, improve quality, enable real-time control, and ensure sustainability thus making them essential to globally competitive production systems.

ICEA remains committed to facilitating high-impact, industry-led initiatives that drive technological advancement, innovation, and global competitiveness, and will continue supporting collaborations that strengthen India’s position in the global electronics value chain.

Total portfolio expands by more than 236,000 new products and 127 new suppliers in second quarter

THIEF RIVER FALLS, Minnesota, USA – DigiKey, the leading global electronic components and automation products distributor, extensively expanded its in-stock products available for same-day shipment by adding more than 32,000 innovative new product introductions (NPIs) in the second quarter of 2025. In total, the distributor added over 236,000 new products and 127 new suppliers across its core business, Marketplace and Fulfilled by DigiKey programs in Q2. This recent inventory expansion brings DigiKey’s overall portfolio to more than 16.5 million products.

“DigiKey continues to deliver an unmatched selection of in-stock products and new product introductions across the industry, including wireless, power, interconnect, industrial automation and more,” said Mike Slater, vice president of global business development for DigiKey. “The expansion of our breadth of inventory in Q2 coincides with our steady customer growth, and we are optimistic about the market momentum we have seen in the first half of 2025.”

DigiKey’s long-standing commitment to in-stock inventory expansion for same-day shipment allows customers to order prototype quantities and have those parts shipped immediately without having to place a special order in factory quantities or wait for lead or transit time.

The most recent new supplier additions in the second quarter include:

•             DeGirum, which makes products that solve the demand for simplified AI development and real-time vision processing.

•             Minew, a trusted IoT device manufacturer of traceability products like beacons, Bluetooth smart labels, eco-friendly paper battery tags and more.

•             NanoFlowX, a pioneer in nanotechnology, offers electronic waterproof polymer coating kits that increase the lifespan of electronic devices.

•             Shelly USA, which produces IoT smart automation products like humidity and temperature monitoring modules, din rail mounted relays, dimmers and smart switches.

DigiKey’s inventory expansion is a continued validation that the distributor provides engineers, designers and makers access to the most exciting new products in their industries. Some of the NPIs added in Q2 2025 include:

•             Jauch’s High Temperature CR2032 batteries are designed to withstand temperatures up to 125 degrees Celsius.

•             The new u-blox ZED-X20P series GNSS module provides accuracy down to the centimeter.

•             Adafruit's Sparkle Motion Stick combines an LED driver, a microphone and an ESP32 module on a board with a USB connector.

•             The PG164110 MPLAB PICkit Basic debugger from Microchip is a cost-effective option for simple debugging of popular Microchip microcontrollers and microprocessors.

•             KYOCERA AVX’s 9288-000 two-piece hermaphroditic wire-to-wire and wire-to-board connectors allow for easy wire termination in the field.

•             STMicroelectronics’ ST67W series Wi-Fi®/Bluetooth® LE Coprocessor Modules offer easy integration with STM32 MCUs and MPUs for faster Wi-Fi deployment.

•             The Hirschmann BOBCAT and GREYHOUND Simple Ethernet Switches provide a high-quality selection of popular, cost-effective industrial hardware with secure and future-proof connectivity.

•             Sensirion’s STCC4 miniature CO2 sensor design offers precise and reliable carbon dioxide measurements in ambient indoor air conditions.

•             Siemens’ SIRIUS Modular System provides users with all the devices necessary for switching, protecting, controlling and monitoring motors in an industrial automation setting.

•             Octavo Systems’ OSDZU3 System-in-Package enables the fastest and most flexible way to develop a system around the AMD Zynq UltraScale+ MPSoC by integrating power management, memory and other required components into a single BGA package.

For more information about the suppliers and products in DigiKey’s portfolio, visit DigiKey.com.

•   ST enters into agreement for acquisition of NXP’s MEMS sensor business for a purchase price of up to US$950 million in cash, including US$900 million upfront and US$50 million subject to the achievement of technical milestones

•   The MEMS businesses of ST and NXP are strongly complementary in terms of technology and product portfolio, with the combined product offering to be well balanced across automotive, industrial and consumer end markets

•   NXP’s MEMS Business generated revenue of about US$300 million in calendar year 2024 with gross and operating margins significantly accretive for ST

•   All-cash transaction to be financed from existing liquidity and expected to be accretive to ST Earnings Per Share from completion

Geneva, Switzerland, July 24, 2025 -- STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is strengthening its global sensors capabilities with the planned acquisition of NXP Semiconductors’ (NASDAQ: NXPI) MEMS sensors business, focused on automotive safety products as well as sensors for industrial applications. The transaction will complement and expand ST’s leading MEMS sensors technology and product portfolio, unlocking new opportunities for development across automotive, industrial and consumer applications.

“The planned acquisition is a great strategic fit for ST,” says Marco Cassis, President, Analog, Power & Discrete, MEMS and Sensors Group of STMicroelectronics. “Together with ST’s existing MEMS portfolio, these highly complementary technologies and customer relationships, focused on automotive safety and industrial technologies, will strengthen our position in sensors across key segments in automotive, industrial and consumer applications. By leveraging our IDM model, with technology R&D, product design and advanced manufacturing, we will better serve all our customers worldwide.”

“NXP is a leading supplier of automotive MEMS based motion and pressure sensors, with a long history of strong customer adoption,” said Jens Hinrichsen, Executive Vice President and General Manager, Analog and Automotive Embedded Systems of NXP. “However, after careful portfolio review the company has decided the business does not fit into its long-term strategic direction. We have agreed with STMicroelectronics that the product line will fit ideally into ST’s portfolio, manufacturing footprint and strategic roadmap. We are gratified that the MEMS sensor team will have an excellent home and long-term future at ST.”

The MEMS sensors portfolio to be acquired by ST primarily targets automotive safety sensors, both passive (airbags) and active (vehicle dynamics), as well as monitoring sensors (TPMS1, engine management, convenience, and security). It also includes pressure sensors and accelerometers for industrial applications. ST is well-positioned to leverage strong, established customer relationships with automotive Tier1s with its innovation roadmap in a rapidly expanding MEMS automotive market. MEMS technologies increasingly enable advanced functionalities for safety, electrification, automation, and connected vehicles, paving the way for future revenue growth.

MEMS inertial sensors in Automotive are expected to grow at a faster pace than the broader MEMS market. The business to be acquired generated about 300m$ revenues in 2024 with gross and operating margin both significantly accretive for ST. It is also expected to be accretive to ST Earnings Per Share from completion.

The planned acquisition will enhance ST’s MEMS technology, product R&D capabilities and roadmap, with leading IP, technology and products for automotive safety applications and highly skilled R&D teams. The expanded business will take advantage of ST’s Integrated Device Manufacturer model for MEMS, which involves every stage of MEMS development, from design and manufacturing to testing and packaging, enabling faster innovation cycles and greater flexibility for customization.

STMicroelectronics and NXP have entered into a definitive transaction agreement for a purchase price of up to US$950 million in cash, including US$900 million upfront and US$50 million subject to the achievement of technical milestones. The transaction which will be financed with existing liquidity is subject to customary closing conditions, including regulatory approvals, and is expected to close in H1 2026.

Forward-looking Information

Some of the statements contained in this release that are not historical facts are statements of future expectations and other forward-looking statements (within the meaning of Section 27A of the Securities Act of 1933 or Section 21E of the Securities Exchange Act of 1934, each as amended) that are based on management’s current views and assumptions, and are conditioned upon and also involve known and unknown risks and uncertainties that could cause actual results, performance or events to differ materially from those anticipated by such statements due to, among other factors:

• changes in global trade policies, including the adoption and expansion of tariffs and trade barriers, that could affect the macro-economic environment and may directly or indirectly adversely impact the demand for our products;

• uncertain macro-economic and industry trends (such as inflation and fluctuations in supply chains), which may impact production capacity and end-market demand for our products;

• customer demand that differs from projections which may require us to undertake transformation measures that may not be successful in realizing the expected benefits in full or at all;

• the ability to design, manufacture and sell innovative products in a rapidly changing technological environment;

• changes in economic, social, public health, labor, political, or infrastructure conditions in the locations where we, our customers, or our suppliers operate, including as a result of macro-economic or regional events, geopolitical and military conflicts, social unrest, labor actions, or terrorist activities;

• unanticipated events or circumstances, which may impact our ability to execute our plans and/or meet the objectives of our R&D and manufacturing programs, which benefit from public funding;

• financial difficulties with any of our major distributors or significant curtailment of purchases by key customers;

• the loading, product mix, and manufacturing performance of our production facilities and/or our required volume to fulfill capacity reserved with suppliers or third-party manufacturing providers;

• availability and costs of equipment, raw materials, utilities, third-party manufacturing services and technology, or other supplies required by our operations (including increasing costs resulting from inflation);

• the functionalities and performance of our IT systems, which are subject to cybersecurity threats and which support our critical operational activities including manufacturing, finance and sales, and any breaches of our IT systems or those of our customers, suppliers, partners and providers of third-party licensed technology;

• theft, loss, or misuse of personal data about our employees, customers, or other third parties, and breaches of data privacy legislation;

• the impact of IP claims by our competitors or other third parties, and our ability to obtain required licenses on reasonable terms and conditions;

• changes in our overall tax position as a result of changes in tax rules, new or revised legislation, the outcome of tax audits or changes in international tax treaties which may impact our results of operations as well as our ability to accurately estimate tax credits, benefits, deductions and provisions and to realize deferred tax assets;

• variations in the foreign exchange markets and, more particularly, the U.S. dollar exchange rate as compared to the Euro and the other major currencies we use for our operations;

• the outcome of ongoing litigation as well as the impact of any new litigation to which we may become a defendant;

• product liability or warranty claims, claims based on epidemic or delivery failure, or other claims relating to our products, or recalls by our customers for products containing our parts;

• natural events such as severe weather, earthquakes, tsunamis, volcano eruptions or other acts of nature, the effects of climate change, health risks and epidemics or pandemics in locations where we, our customers or our suppliers operate;

• increased regulation and initiatives in our industry, including those concerning climate change and sustainability matters and our goal to become carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027;

• epidemics or pandemics, which may negatively impact the global economy in a significant manner for an extended period of time, and could also materially adversely affect our business and operating results;

• industry changes resulting from vertical and horizontal consolidation among our suppliers, competitors, and customers;

• the ability to successfully ramp up new programs that could be impacted by factors beyond our control, including the availability of critical third-party components and performance of subcontractors in line with our expectations; and

• individual customer use of certain products, which may differ from the anticipated uses of such products and result in differences in performance, including energy consumption, may lead to a failure to achieve our disclosed emission-reduction goals, adverse legal action or additional research costs.

Such forward-looking statements are subject to various risks and uncertainties, which may cause actual results and performance of our business to differ materially and adversely from the forward-looking statements. Certain forward-looking statements can be identified by the use of forward-looking terminology, such as “believes”, “expects”, “may”, “are expected to”, “should”, “would be”, “seeks” or “anticipates” or similar expressions or the negative thereof or other variations thereof or comparable terminology, or by discussions of strategy, plans or intentions.

Some of these risk factors are set forth and are discussed in more detail in “Item 3. Key Information — Risk Factors” included in our Annual Report on Form 20-F for the year ended December 31, 2024 as filed with the Securities and Exchange Commission (“SEC”) on February 27, 2025. Should one or more of these risks or uncertainties materialize, or should underlying assumptions prove incorrect, actual results may vary materially from those described in this press release as anticipated, believed or expected. We do not intend, and do not assume any obligation, to update any industry information or forward-looking statements set forth in this release to reflect subsequent events or circumstances.

Unfavorable changes in the above or other factors listed under “Item 3. Key Information — Risk Factors” from time to time in our Securities and Exchange Commission (“SEC”) filings, could have a material adverse effect on our business and/or financial condition.

Bengaluru – July 25, 2025: VIAVI Solutions showcased its latest data center test, monitoring and orchestration solutions at the recently held Data Center Conclave, Mumbai.

At the Data center conclave, VIAVI demonstrated its latest portfolio of test and optimization solutions for the next generation of data centers :

• The OneAdvisor 800 with 400G Transport Module is the industry’s most integrated and compact tool for up to 400Gbps testing. This solution provides full rate coverage to address service activation, troubleshooting, and maintenance. Its portability and modularity make OneAdvisor 800 perfectly suited for metro/core, data center interconnect, and business services testing.

 • INX 760 probe microscope delivers the industry’s fastest inspection and analysis of single, duplex and multi-fiber connectors in applications ranging from hyperscale data centers, metro core construction, telco distribution and more.

VIAVI also showcased its comprehensive portfolio of field test solutions for fiber construction and maintenance, remote fiber test and monitoring, dense fiber testing inside data centers, and high-speed metro and automated network test. Solutions that guarantee and protect DCI, including the FiberComplete PRO, Test Process Automation (TPA) and ONMSi.

Bengaluru, India | July 23, 2025 — The 9th IEEE International Test Conference India (ITC India 2025) concluded on a high note in Bengaluru, held between 20th and 22nd July, reaffirming its role as a strategic platform to advance India’s growing presence in the global semiconductor ecosystem.

Bringing together hundreds of professionals from across industry and academia, this year’s edition spotlighted the latest breakthroughs in semiconductor test, validation, simulation, and system-level reliability. With a diverse lineup of global speakers, parallel technical tracks, panel discussions, and live technology showcases, the event served as a crucial bridge between research, application, and industry demand.

Supported by leading technology companies including Caliber Interconnects, Siemens, Tessolve, Google, Cadence, Synopsys, Qualcomm, DeFT, Soliton, Anora, Mirafra, Advantest, and Maven Silicon, the conference created a dynamic environment for learning, networking, and collaboration. Exhibitors demonstrated a wide array of products and solutions spanning AI-enabled test automation, advanced DFT methodologies, post-silicon validation tools, yield optimization, and system reliability platforms.

Organized with the technical backing of IEEE Bangalore Section, along with IESA, VLSI Society, and other strategic partners, the event saw increased participation and positive feedback, with attendees noting stronger footfall, richer content, and valuable peer engagement compared to previous editions.

One of the most impactful moments of the event was the final day keynote by Mr. Suresh Babu K, Managing Director, Caliber Interconnect Solutions, titled “From Silicon to Solutions: The Societal Impact of Semiconductor Leadership.” His address mapped out the future of the semiconductor industry by highlighting:

•  The Global Semiconductor Mission and India's rising role

•  Time-to-market acceleration and quality assurance as competitive levers

•  Challenges in test scalability

•  The evolution of test—from design to validation

•  Strategic priorities and ecosystem collaboration to fuel innovation and self-reliance

He emphasized that India’s engineering services companies must adapt continuously to technology shifts across end-product lifecycles, and pointed to the significant job opportunities emerging in this evolving test ecosystem.

“Our readiness to provide design-to-validation solutions will define India’s contribution to the global semiconductor value chain,” said Mr. Suresh Babu, urging greater collaboration among industry stakeholders, startups, and academia.

Global Thought Leaders at the Forefront of Innovation. Other notable keynotes that enriched the conference included

•  “The Right Testing Strategy Can Save Designs” by Nitza Basoco, Teradyne

•  “Rethinking Silicon Test to Reduce DPPM and SDC” by Dr. Sreejit Chakravarty, IEEE Fellow & Distinguished Engineer, Ampere Computing (USA)

•  “Transformative Design-for-Test Technologies for Silicon Lifecycle Management” by Janusz Rajski, Siemens EDA

•  “The Future of AI Hardware Enabled by Advanced Packaging” by Raja Swaminathan, AMD (USA)

•  “Enabling Efficient Prototyping for Fabless Design Houses” by Rajesh V, Senior VP – Test & Product Engineering, Tessolve (India)

These sessions underscored the critical role of innovation in reducing test escape rates, improving yield predictability, and ensuring robustness in next-generation chips, especially as AI, edge computing, and automotive electronics demand more complex test coverage.

Strengthening India’s Semiconductor Future

The conference fostered cross-disciplinary conversations around:

•  AI/ML in test analytics

•  Secure test infrastructures for hardware IP

•  EDA-cloud synergy for scalable simulation

•  Prototyping efficiency for fabless startups

As India makes bold strides toward becoming a global semiconductor hub, IEEE ITC India 2025 has once again proven to be a vital ecosystem enabler — connecting visionaries, technologists, and innovators who are defining the future of silicon reliability and performance.

Saravanam J

9880974765

•  The EMS industry in India, is witnessing a strong growth momentum across industry verticals.

•  The company remains confident in its prospects and aims to grow in line with the industry's momentum.

India, Mumbai, July 24, 2025: The company for the Quarter ended 30th June 2025, reported a consolidated total revenue of ₹ 9,600 mn, compared to ₹ 11,752, mn for the corresponding period ended 30th June 2024, with Industrials and Auto segement being the key contributors during the period.

The Consolidated EBITDA was up by 69% YoY to ₹ 1,027 mn as against ₹ 607 mn for the corresponding period of the previous year. Profit after Tax was ₹ 499 mn, up by 145% YoY as compared to ₹ 203 mn last year.

Brief Financials for the Quarter ended 30th June’25

(Amount in ₹ Million)