Electronics news & updates

• Q3 net revenues $3.19 billion; gross margin 33.2%; operating income of $180 million, including $37 million related to impairment, restructuring charges and other related phase-out costs; net income of $237 million
• Business outlook at mid-point: Q4 net revenues of $3.28 billion and gross margin of 35.0%  

Geneva, October 23, 2025 – STMicroelectronics N.V. (“ST”) (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, reported U.S. GAAP financial results for the third quarter ended September 27, 2025. This press release also contains non-U.S. GAAP measures (see Appendix for additional information).
 

ST reported third quarter net revenues of $3.19 billion, gross margin of 33.2%, operating income of $180 million, and net income of $237 million or $0.26 diluted earnings per share (non-U.S. GAAP¹ operating income of $217 million, and non-U.S. GAAP¹ net income of $267 million or $0.29 diluted earnings per share).

Jean-Marc Chery, ST President & CEO, commented: 

• “Q3 net revenues came slightly above the mid-point of our business outlook range, with higher revenues in Personal Electronics, while Automotive and Industrial performed as anticipated, and CECP was broadly in line with expectations. Gross margin was slightly below the mid-point of our business outlook range mainly due to product mix within Automotive and Industrial.”
• “On a year-over-year basis, Q3 net revenues decreased 2.0%, non-U.S. GAAP¹ operating margin decreased to 6.8% from 11.7% and non-U.S. GAAP¹ net income decreased to $267 million from $351 million.”
• “In the third quarter, our book-to-bill ratio was above one, with Automotive above parity and Industrial at parity.”
• “Our fourth quarter business outlook, at the mid-point, is for net revenues of $3.28 billion, increasing sequentially by 2.9%, gross margin is expected to be about 35.0%; including about 290 basis points of unused capacity charges.”
• “The mid-point of this outlook translates into full year 2025 revenues of about $11.75 billion. This represents a 22.4% growth in the second half compared to the first half, confirming signs of market recovery. Gross margin is expected to be about 33.8%.”
• To optimize our investments in response to the current market conditions, we have reduced our Net Capex plan, now slightly below $2 billion for FY25.”
• “Our strategic priorities remain clear: accelerating innovation; executing our company-wide program to reshape our manufacturing footprint and resize our global cost base, which remains on schedule to deliver the targeted savings; and strengthening free cash flow generation.”

Quarterly Financial Summary

Third Quarter 2025 Summary Review

Reminder: on January 1, 2025, we made some adjustments to our segment reporting. Prior year comparative periods have been adjusted accordingly. See Appendix for more detail.

Net revenues totaled $3.19 billion, representing a year-over-year decrease of 2.0%. Year-over-year net sales to OEMs and Distribution decreased 5.1% and increased 7.6%, respectively. On a sequential basis, net revenues increased 15.2%, 60 basis points better than the mid-point of ST’s guidance.

Gross profit totaled $1.06 billion, representing a year-over-year decrease of 13.7%. Gross margin of 33.2%, 30 basis points below the mid-point of ST’s guidance, decreased 460 basis points year-over-year, mainly due to lower manufacturing efficiencies, negative currency effect, lower level of capacity reservation fees and, to a lesser extent, the combination of sale price and product mix.

Operating income decreased from $381 million in the year-ago quarter to $180 million. ST’s operating margin decreased 610 basis points on a year-over-year basis to 5.6% of net revenues, compared to 11.7% in the third quarter of 2024. Operating income included $37 million impairment, restructuring charges and other related phase-out costs for the quarter, reflecting impairment of assets and restructuring charges predominantly associated with the previously announced company-wide program to reshape our manufacturing footprint and resize our global cost base. Excluding these items, non-U.S. GAAP¹ Operating income stood at $217 million in the third quarter.

By reportable segment, compared with the year-ago quarter:
 

In Analog, Power & Discrete, MEMS and Sensors (APMS) Product Group:

Analog products, MEMS and Sensors (AM&S) segment:

• Revenue increased 7.0% mainly due to Imaging.   
• Operating profit increased by 2.1% to $221 million. Operating margin was 15.4% compared to 16.1%.

Power and Discrete products (P&D) segment:

• Revenue decreased 34.3%.
• Operating profit decreased from $80 million to an operating loss of $67 million. Operating margin was -15.6% compared to 12.2%.

In Microcontrollers, Digital ICs and RF products (MDRF) Product Group:

Embedded Processing (EMP) segment:

• Revenue increased 8.7% mainly due to General Purpose MCU.
• Operating profit increased by 9.4% to $161 million. Operating margin was 16.5% compared to 16.4%.  

RF & Optical Communications (RF&OC) segment:

• Revenue decreased 3.4%.
• Operating profit decreased by 31.6% to $57 million. Operating margin was 16.6% compared to 23.4%.

Net Earnings and diluted Earnings Per Share decreased to $237 million and $0.26 respectively, compared to $351 million and $0.37 respectively in the year-ago quarter. Non-U.S. GAAP¹ Net income and diluted Earnings Per Share, stood at $267 million and $0.29 respectively in the third quarter of 2025.

Cash Flow and Balance Sheet Highlights 

Net cash from operating activities was $549 million in the third quarter compared to $723 million in the year-ago quarter.

Net Capex (non-U.S. GAAP¹), was $401 million in the third quarter compared to $565 million in the year-ago quarter.
 

Free cash flow (non-U.S. GAAP¹) was positive $130 million in the third quarter, compared to positive $136 million in the year-ago quarter.

Inventory at the end of the third quarter was $3.17 billion, compared to $3.27 billion in the previous quarter and $2.88 billion in the year-ago quarter. Days sales of inventory at quarter-end was 135 days, compared to 166 days for the previous quarter and 130 days for the year-ago quarter.

In the third quarter, ST paid cash dividends to its stockholders totaling $81 million and executed a $91 million share buy-back, as part of its current share repurchase program.
 

ST’s net financial position (non-U.S. GAAP⁴) remained strong at $2.61 billion as of September 27, 2025, compared to $2.67 billion as of June 28, 2025, and reflected total liquidity² of $4.78 billion and total financial debt of $2.17 billion. Adjusted net financial position (non-U.S. GAAP¹), taking into consideration the effect on total liquidity of advances from capital grants for which capital expenditures have not been incurred yet, stood at $2.27 billion as of September 27, 2025.

Corporate developments

On July 24, 2025, ST entered into a definitive transaction agreement for the acquisition of NXP’s MEMS sensor business for a purchase price of up to $950 million in cash, including $900 million upfront and $50 million subject to the achievement of technical milestones. The transaction which will be financed with existing liquidity is subject to customary closing conditions, including regulatory approvals, and is expected to close in H1 2026.

Business Outlook

ST’s guidance, at the mid-point, for the 2025 fourth quarter is:

• Net revenues are expected to be $3.28 billion, an increase of 2.9% sequentially, plus or minus 350 basis points.
• Gross margin of 35.0%, plus or minus 200 basis points.
• This outlook is based on an assumed effective currency exchange rate of approximately $1.15 = €1.00 for the 2025 fourth quarter and includes the impact of existing hedging contracts.
• The fourth quarter will close on December 31, 2025.

This business outlook does not include any impact of potential further changes to global trade tariffs compared to the current situation.
 

Conference Call and Webcast Information

ST will conduct a conference call with analysts, investors and reporters to discuss its third quarter 2025 financial results and current business outlook today at 9:30 a.m. Central European Time (CET) / 3:30 a.m. U.S. Eastern Time (ET). A live webcast (listen-only mode) of the conference call will be accessible at ST’s website, https://investors.st.com, and will be available for replay until November 7, 2025.

Use of Supplemental Non-U.S. GAAP Financial Information
This press release contains supplemental non-U.S. GAAP financial information.

Readers are cautioned that these measures are unaudited and not prepared in accordance with U.S. GAAP and should not be considered as a substitute for U.S. GAAP financial measures. In addition, such non-U.S. GAAP financial measures may not be comparable to similarly titled information from other companies. To compensate for these limitations, the supplemental non-U.S. GAAP financial information should not be read in isolation, but only in conjunction with ST’s consolidated financial statements prepared in accordance with U.S. GAAP.

See the Appendix of this press release for a reconciliation of ST’s non-U.S. GAAP financial measures to their corresponding U.S. GAAP financial measures.

Forward-looking Information

Some of the statements contained in this release that are not historical facts are statements of future expectations and other forward-looking statements (within the meaning of Section 27A of the Securities Act of 1933 or Section 21E of the Securities Exchange Act of 1934, each as amended) that are based on management’s current views and assumptions, and are conditioned upon and also involve known and unknown risks and uncertainties that could cause actual results, performance or events to differ materially from those anticipated by such statements due to, among other factors:

• changes in global trade policies, including the adoption and expansion of tariffs and trade barriers, that could affect the macro-economic environment and directly or indirectly adversely impact the demand for our products;
• uncertain macro-economic and industry trends (such as inflation and fluctuations in supply chains), which may impact production capacity and end-market demand for our products;
• customer demand that differs from projections which may require us to undertake transformation measures that may not be successful in realizing the expected benefits in full or at all;
• the ability to design, manufacture and sell innovative products in a rapidly changing technological environment;
• changes in economic, social, public health, labor, political, or infrastructure conditions in the locations where we, our customers, or our suppliers operate, including as a result of macro-economic or regional events, geopolitical and military conflicts, social unrest, labor actions, or terrorist activities;
• unanticipated events or circumstances, which may impact our ability to execute our plans and/or meet the objectives of our R&D and manufacturing programs, which benefit from public funding;
• financial difficulties with any of our major distributors or significant curtailment of purchases by key customers;
• the loading, product mix, and manufacturing performance of our production facilities and/or our required volume to fulfill capacity reserved with suppliers or third-party manufacturing providers;
• availability and costs of equipment, raw materials, utilities, third-party manufacturing services and technology, or other supplies required by our operations (including increasing costs resulting from inflation);
• the functionalities and performance of our IT systems, which are subject to cybersecurity threats and which support our critical operational activities including manufacturing, finance and sales, and any breaches of our IT systems or those of our customers, suppliers, partners and providers of third-party licensed technology;
• theft, loss, or misuse of personal data about our employees, customers, or other third parties, and breaches of data privacy legislation;
• the impact of IP claims by our competitors or other third parties, and our ability to obtain required licenses on reasonable terms and conditions;
• changes in our overall tax position as a result of changes in tax rules, new or revised legislation, the outcome of tax audits or changes in international tax treaties which may impact our results of operations as well as our ability to accurately estimate tax credits, benefits, deductions and provisions and to realize deferred tax assets;
• variations in the foreign exchange markets and, more particularly, the U.S. dollar exchange rate as compared to the Euro and the other major currencies we use for our operations;
• the outcome of ongoing litigation as well as the impact of any new litigation to which we may become a defendant;
• product liability or warranty claims, claims based on epidemic or delivery failure, or other claims relating to our products, or recalls by our customers for products containing our parts;
• natural events such as severe weather, earthquakes, tsunamis, volcano eruptions or other acts of nature, the effects of climate change, health risks and epidemics or pandemics in locations where we, our customers or our suppliers operate;
• increased regulation and initiatives in our industry, including those concerning climate change and sustainability matters and our goal to become carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027;
• epidemics or pandemics, which may negatively impact the global economy in a significant manner for an extended period of time, and could also materially adversely affect our business and operating results;
• industry changes resulting from vertical and horizontal consolidation among our suppliers, competitors, and customers;
• the ability to successfully ramp up new programs that could be impacted by factors beyond our control, including the availability of critical third-party components and performance of subcontractors in line with our expectations; and

• Four new 5MP image sensors allow customers to optimize image capture with high speed, high detail with a single, flexible product instead of two chips
• New device family is ideal for high-speed automated manufacturing processes and object tracking
• New sensors leverage market-leading technology for both global and rolling shutter modes, with a compact 2.25µm pixel with advanced 3D stacking, and on-chip RGB-IR separation

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, introduces a new family of 5MP CMOS image sensors: VD1943, VB1943, VD5943, and VB5943. These advanced ST BrightSense sensors are designed to accelerate the development of innovative vision applications across industries, including advanced industrial automation with enhanced machine and robotic vision, next-generation security including biometric identification and traffic management, and smart retail applications such as inventory management and automated checkout. A longtime leader in optical sensing technology for consumer applications, ST continues to expand its offering for new applications with its industry-leading design, 3D stacking expertise and high-volume manufacturing for market-leading performance.

“Our new image sensors with hybrid global and rolling shutter modes allow our customers to optimize image capture, ensuring motion-artifact-free video capture and low-noise, high-detail imaging at the same time, making it ideal for high-speed automated manufacturing processes and object tracking. This architecture is unique on market today and provides unmatched flexibility, performance, and integration. We continue to broaden our portfolio of solutions for a wide range of industrial applications and want to bring the best of optical sensing technologies to both existing and new applications,” said Alexandre Balmefrezol, Executive Vice President and General Manager of STMicroelectronics’s Imaging Sub-Group.

"Industrial and security imaging are pushing sensor performance to new levels, enabling functions from identification to robotic guidance, gauging and advanced monitoring and inspection,” said Florian Domengie, PhD Principal Analyst Imaging at Yole Group. “By 2030, this image sensor market is projected to reach $3.9 billion with over 500 million units shipped. Key advances will include enhanced low-light performance, on-chip intelligence, and hybrid global/rolling shutter operation, combining low noise with high-precision temporal sensing."*

*Source: Status of the CMOS Image Sensor Industry 2025 – 3D Imaging & Sensing 2025, Yole Group

Technical notes

The VD1943, VD5943, VB1943, and VB5943 sensors, part of the ST BrightSense portfolio, are ready for evaluation and sampling, with mass production scheduled to begin in February 2026. Detailed documentation, evaluation kits, and product samples, are available through the local ST sales representative or an authorized distributor.

Dual global and rolling shutter modes

The sensors provide hybrid global and rolling shutter modes, allowing developers to optimize image capture for specific application requirements. This functionality ensures motion-artifact-free video capture (global shutter) and low-noise, high-detail imaging (rolling shutter), making it ideal for high-speed object tracking and automated manufacturing processes.

Compact design with advanced pixel technology

Using 2.25 µm pixel technology and advanced 3D stacking, the sensors deliver high image quality in a smaller footprint. The die size is 5.76 mm by 4.46 mm, with a package size of 10.3 mm by 8.9 mm, and an industry-leading 73%-pixel array-to-die surface ratio. This compact design enables integration into space-constrained embedded vision systems without compromising performance.

On-chip RGB-IR separation

The RGB-IR variants of the sensors feature on-chip RGB-IR separation, eliminating the need for additional components and simplifying system design. This capability supports multiple output patterns, including 5MP RGB-NIR 4x4, 5MP RGB Bayer, 1.27MP NIR subsampling, and 5MP NIR smart upscale, with independent exposure times and instant output pattern switching. This integration reduces costs while maintaining full 5MP resolution for both color and infrared imaging.

Enhanced imaging performance

The sensors incorporate backside illumination (BSI) and capacitive deep trench isolation (CDTI) pixel technologies to enhance sensitivity and sharpness, particularly in low lighting conditions. Single-frame on-chip HDR improves detail visibility across bright and dark areas. These features enable high-quality imaging in challenging environments and support advanced machine vision and edge AI applications.

• Designed, built, owned, and operated by a joint venture between SP Group and Daikin Airconditioning (Singapore), the innovative district cooling system will significantly improve the environmental performance of ST’s high-volume semiconductor manufacturing site in Singapore
• New system expected to reduce carbon emissions by 120,000 tonnes per year, cooling-related electricity costs by 20 percent each year, and repurposing over half a million cubic meters of water consumption per year

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and SP Group (SP), a leading utilities group in the Asia Pacific and Singapore’s national grid operator, have commenced operations for Singapore’s largest industrial district cooling system at STMicroelectronics’ (ST) Ang Mo Kio TechnoPark. The event was inaugurated by Ms. Low Yen Ling, Senior Minister of State, Ministry of Trade and Industry and Ministry of Culture, Community and Youth.

The system is expected to reduce carbon emissions by up to 120,000 tonnes per year and enable 20 per cent savings on cooling-related electricity consumption. It will also repurpose over half a million cubic meters of water each year by using reject reverse osmosis water, previously used in ST Cooling Towers, to support the new district cooling operations. 

This marks ST’s first use of district cooling at a manufacturing facility and will strengthen ST’s commitment to be carbon neutral by 2027.

“The deployment of Singapore’s largest industrial district cooling system at our Ang Mo Kio TechnoPark demonstrates our commitment to pioneering energy-efficient solutions that reduce carbon emissions and conserve resources. This achievement strengthens our partnership with Singapore in advancing its national sustainability goals,” said Rajita D’Souza, President of Human Resources and Corporate Social Responsibility at STMicroelectronics. “By integrating advanced technologies like the district cooling system, we are driving a smarter, more sustainable future — showcasing how industry leadership and environmental stewardship align to create lasting value for our business, communities, and the planet.”

“SP Group’s strategic partnership with STMicroelectronics marks a pivotal milestone in our nation’s transition towards a low-carbon future. This project showcases how collaborative innovation can transform urban infrastructure to deliver sustainable, energy-efficient solutions. District cooling will continue to play a vital role in Singapore’s net-zero ambitions, enabling carbon emissions reduction and enhancing energy resilience across industrial and urban developments,” said Stanley Huang, SP’s Group Chief Executive Officer. 

Technical information about the district cooling system 

Designed, built, owned, and operated by a joint venture between SP and Daikin Airconditioning (Singapore), the system has an installed capacity of up to 36,000 refrigeration tonnes (RT). It delivers continuous chilled water to cool both manufacturing and office spaces via a centralized closed-loop pipe network replacing individual chillers in each building. The total area served by the system is approximately 90,000 square metres.

Chillers in series counterflow configuration reduce the energy required to cool the water. This ensures an efficient and reliable 24/7 operation, with remote monitoring capabilities augmenting the operations team on site to come.

“This partnership with SP reflects Daikin’s commitment to delivering advanced, energy-efficient solutions that go beyond immediate operational needs. Our goal is to contribute to a more sustainable built environment, where technology plays a key role in enhancing resilience, reducing environmental impact, and supporting Singapore’s long-term climate ambitions,” said Chua Ban Hong, Managing Director at Daikin Airconditioning (Singapore).

Additionally, the new installations free up around 4,000 square meters of space at Ang Mo Kio TechnoPark, which will enable ST to install other equipment contributing to environmental impact mitigation. This includes perfluorocarbon (PFC) abatement equipment, with near-future plans for additional water reclamation systems and volatile organic compounds (VOC) abatement as part of its ongoing sustainability efforts.

The project achieved over 2 million accident-free man hours, underscoring the commitment to safety during construction. The district cooling plant has been awarded the Green Mark Platinum Super Low Energy certification by the Building and Construction Authority for its exceptional energy efficiency and sustainable design. Incorporating whole-life carbon assessments during design and construction of the plant also enabled a reduction of about 44 percent in embodied carbon compared to industrial building benchmarks, achieved through optimized material choices and system design to further lower the plant’s carbon footprint.

Further collaboration between STMicroelectronics and SP Group

To accelerate its decarbonization roadmap, ST has also partnered with SP to upgrade the cooling system at its Toa Payoh site. Under a 20-year chilled-water-as-a-service agreement, SP will design, build, operate, and maintain a new high-efficiency chiller system, scheduled for completion by December 2025. The system will improve energy efficiency and aims to reduce carbon emissions by approximately 2,140 tonnes annually.

In addition to sustainable cooling solutions, STMicroelectronics and SP Group are implementing a range of sustainable technologies across ST’s Ang Mo Kio and Toa Payoh campuses.

This includes the deployment of the energy management information system (EMIS), comprising 2,400 smart electricity meters and multi-utility sensors. With SP’s smart metering infrastructure in place, ST can monitor its overall energy consumption – enabling data-driven decisions that enhance efficiency and sustainability.

SP has also implemented smart water meters that track water inflow to five of ST’s buildings. This provides ST with an accurate view of its water consumption, allowing the organization to enhance its critical wafer fabrication operations by ensuring greater water efficiency.

Together, the partnership delivers on a shared vision for a smarter, cleaner energy future through integrated digitalization and decarbonization at scale.

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced that it will release third quarter 2025 earnings before the opening of trading on the European Stock Exchanges on October 23, 2025.

The press release will be available immediately after the release on the Company’s website at www.st.com.

STMicroelectronics will conduct a conference call with analysts, investors and reporters to discuss its third quarter 2025 financial results and current business outlook on October 23, 2025 at 9:30 a.m. Central European Time (CET) / 3:30 a.m. U.S. Eastern Time (ET).

A live webcast (listen-only mode) of the conference call will be accessible at ST’s website, https://investors.st.com, and will be available for replay until November 7, 2025.

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced that Rias Al-Kadi, General Manager of the Company’s Range and Connectivity Division, has joined the board of directors of the FiRa^® Consortium, the industry body dedicated to advancing secured fine ranging and positioning ultra-wideband (UWB) technology.

ST is actively driving the development the IEEE 802.15.4ab amendment, building upon previous UWB enhancements to further improve system performance and expand UWB’s application scope. The ongoing evolution of UWB standards promises significant improvements, including centimeter-level accuracy, enhanced security, and reduced power consumption. These improvements are critical for enabling a wide range of applications, from automotive access and digital keys to smart home automation and IoT innovations. Integrating IEEE 802.15.4ab into the CCC Digital Key ecosystem would represent a major step forward in addressing implementation challenges and accelerate broader adoption of UWB technology in both consumer and automotive markets.

“STMicroelectronics has long been a valued member of the FiRa Consortium, and we are thrilled to welcome them at the Sponsor level. This upgrade is a reflection of ST’s deepening commitment to the future of Ultra-Wideband technology and to FiRa’s mission. We are especially pleased to have Rias Al-Kadi, General Manager of ST’s Ranging and Connectivity Division, join our Board of Directors. His experience and leadership will be instrumental as we continue to expand UWB’s global impact and shape the future of secure, interoperable solutions,” states SK Yong, FiRa Consortium Board Chairman.

“Joining the FiRa board underlines our commitment to advancing the CCC Digital Key and other UWB-based applications,” said Rias Al-Kadi, General Manager, Ranging and Connectivity Division, STMicroelectronics. “By deeply engaging in standardization and certification across all major UWB groups, we are helping to shape the future of UWB technology to deliver maximum value for consumers and industries alike.”

Rias Al-Kadi’s appointment further strengthens ST’s active participation in key UWB standards bodies and consortia, including the IEEE, Connected Car Consortium (CCC), Connectivity Standards Alliance (CSA), and UWB Alliance. Through strategic participation in these groups, ST supports the continuous evolution of UWB technology aimed at enhancing user experiences and lowering system costs, particularly in consumer and automotive access applications. This aligns with ST’s vision to foster a robust UWB ecosystem that enables seamless, secure, and cost-effective solutions for the growing UWB market.

Note to the editor
UWB is a precise ranging and radar technology within the IEEE 802 wireless standards group that also includes WiFi and Bluetooth. Supported by the latest smartphones from leading brands, UWB offers high resistance to interference and enhances diverse applications such as smart appliance interaction and device tracking. With security extensions, standardized under IEEE 802.15.4z, UWB addresses access control use cases, including digital car keys that localize the key in relation to the vehicle. Additional automotive applications include vehicle occupant detection to improve child and pet safety.

Key advancements in UWB specifications are overcoming critical scenarios such as reliability detecting a key or phone in a user’s back pocket to ensure seamless user experiences. Another significant improvement is the potential reduction in the number of anchors required in car access systems, enabling more cost-effective designs without compromising performance.

For more information on STMicroelectronics’ UWB solutions and ecosystem contributions, visit www.st.com/uwb.

• Starting mass production of an advanced interior sensing system for a premium European carmaker for enhanced driver and passenger monitoring

• Cost-effective single-camera solution combines Tobii’s interior-sensing technology and ST’s imaging sensors to deliver wide-angle, high-quality imaging in daytime and nighttime environments

Tobii, the global leader in eye tracking and pioneer of attention computing, and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced the beginning of mass production of an advanced interior sensing system for a premium European carmaker. It integrates a wide field-of-view camera able to see in daylight and at night with next-level driver and occupant monitoring, pushing the boundaries of user experience and safety.

“We’re very proud to bring this groundbreaking system to life. This is more than just technology; it’s a vision,” said Adrian Capata, senior vice president of Tobii Autosense. “Image quality is critical, and thanks to our strong collaboration with ST, we’ve achieved a unique balance that allows a single-camera solution to meet rigorous safety standards, while also unlocking enhanced user experiences. By combining visible and IR sensing, we’re enabling intelligent in-cabin environments that truly understand human presence, behavior, and context.”

“As a result of close collaboration on development and integration with Tobii, we have created a new generation of interior sensing technology that is reliable, user-friendly, and ready for widespread adoption across the automotive industry,” said Alexandre Balmefrezol, Executive Vice President and General Manager of the Imaging Sub-Group at STMicroelectronics. “We are now rapidly expanding our production capacity to meet the anticipated demand and ensure a seamless transition to mass manufacturing.”

Technical information on the interior sensing system
Tobii’s and ST’s integrated approach allows automotive OEMs to install just one camera inside the cabin, providing the most mature, efficient, and cost-effective solution available on the market.

The system combines Tobii’s attention-computing technology with STMicroelectronics’ VD1940, an advanced image sensor designed primarily for automotive applications. This sensor features a single 5.1MP hybrid pixel design, sensitive to both RGB (color in daytime) and infrared (IR at nighttime) light. Its wide-angle field of view covers the entire cabin, delivering exceptional image quality. Tobii’s algorithms process dual video streams to support both the Driver Monitoring System (DMS) and Occupancy Monitoring System (OMS).

Tobii, with its automotive business segment Tobii Autosense, is a leading player in automotive interior sensing and has design wins across more than 160 vehicle models with both driver monitoring solutions (DMS) and occupancy monitoring solutions (OMS) shipping in vehicles on the road.

The VD1940 image sensor is part of the SafeSense by ST, an advanced sensing technology platform designed by STMicroelectronics for DMS and OMS. which embeds functional safety and cyber security features and is dedicated to automotive safety applications. With this innovative product portfolio ST is delivering reliable, high-quality, and cost-effective solutions tailored to the automotive industry. As an Integrated Device Manufacturer (IDM), STMicroelectronics masters the complete image sensor supply chain, with full control over both design and manufacturing processes. This ensures supply security through production of its imaging solutions in its European fabs, with these devices already in mass production and ready for integration by Tier 1s and OEMs.

Read more about Tobii´s automotive offering here.

Read more about STMicroelectronics’ SafeSense by ST imaging solutions here.

• 24 leading technology companies and universities from 11 EU countries are joining efforts, driven by STMicroelectronics, to establish Europe as a technology leader in 300mm silicon photonics (SiPho) technology
• First silicon photonics applications-based innovations expected for datacenters and AI clusters, telecommunications, and automotive markets

The STARLight project brings together a consortium of leading industrial and academic partners to position Europe as a technology leader in 300mm silicon photonics (SiPho) technology by establishing a high-volume manufacturing line, developing leading-edge optical modules, and fostering a complete value chain.  From now until 2028, STARLight aims to develop application-driven solutions focusing on key industry sectors such as datacenters, AI clusters, telecommunications, and automotive markets.

Led by STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, the STARLight consortium has been selected by the European Commission under the EU CHIPS Joint Undertaking initiative.

“Silicon Photonics technology is critical to put Europe at the crossroads to the AI factory of the future and the STARLight project represents a significant step for the entire value chain in Europe, driving innovation and collaboration among leading technology companies. By focusing on application-based results, the project aims to deliver cutting-edge solutions for datacenters, AI clusters, telecommunications, and automotive markets. With well-recognized pan-European partners, the STARLight consortium is set to lead the next generation of silicon photonics technologies and applications,” said Remi El-Ouazzane, President, Microcontrollers, Digital ICs and RF products Group at STMicroelectronics.

 
Silicon photonics is a preferred technology to support datacenters and AI clusters optical interconnects for scale-out and scale-up growth, as well as for other technologies such as LIDAR, space applications and AI photonic processors that require better energy-efficiency and power efficient data transfer. It combines the high-yield manufacturing capabilities of CMOS silicon, commonly used in electronic circuits, with the benefits of photonics, which transmits data using light.

Addressing key challenges
The development of advanced Photonic Integrated Circuits (PICs) will tackle several challenges:

• High-speed modulation: creating highly efficient modulators capable of operating at speeds exceeding 200 Gbps per lane is a key focus
• Laser integration: developing efficient and reliable on-chip lasers is critical for integrated systems
• New materials: various advanced materials will be explored with actors like SOITEC, CEA-LETI, imec, UNIVERSITE PARIS-SACLAY, III-V LAB, LUMIPHASE, and integrated on a single innovative silicon photonics platform, such as Silicon-on-Insulator (SOI), Lithium Niobate (LNOI), and Barium Titanate (BTO)
• Packaging and integration: optimizing the packaging and integration of PICs with electronic circuits is essential to optimize signal integrity and minimize power consumption.

Applications-based innovations
Datacenters / Datacom
The STARLight project has an initial focus to build datacom demonstrators for datacenters, based on PIC100 technology, capable of handling up to 200Gb/s with key actors including ST, SICOYA and THALES. It will also develop prototypes for free-space optical transmission systems, designed for both space and terrestrial communication.

Additionally, the project will leverage the multidisciplinary experience of major contributors to shape the research effort towards a 400Gbps per lane optical demonstrator using new materials, targeting the next generation of pluggable optics.

Artificial Intelligence (AI)
The STARLight project aims to develop a cutting-edge photonic processor optimized for tensor operations, such as matrix vector multiplication and multiply-accumulate, with superior characteristics in terms of size, data processing speed, and energy consumption compared to existing technologies. Since neural networks – the core algorithms behind AI – rely heavily on tensor operations, enhancing their efficiency is critical for AI processing performance.

Telecommunication
The STARLight project plans to develop and showcase innovative silicon photonic devices specifically designed for the telecommunications industry. Ericsson will focus on two concepts to improve mobile network efficiency. The first involves the development of an integrated switch to enable optical offload within Radio Access Networks, allowing for more efficient handling of data traffic. The second concept explores Radio over Fiber technology to relocate power-intensive processing ASICs away from antenna units, thus providing enhanced capacity and savings in embodied CO2. Additionally, MBRYONICS will develop a free space to fiber interface at the reception of Free Space Optical (FSO) communication, which is a key element in the design of an optical communication system.

Automotive/ Sensing
The STARLight project will also demonstrate how it performs in sensing applications, and the close relationships of STEERLIGHT, a LiDAR sensors maker, with leading car manufacturers will help make this an industrial reality.

Within the project, THALES will develop sensors that accurately generate, distribute, detect, and process signals with intricate waveforms to demonstrate key functionalities. More broadly, the outcomes of this project are also intended to benefit the wider ecosystem of indoor and outdoor autonomous robot manufacturers.

STARLight partners quotes
CEA-Leti
“At CEA, we are thrilled to contribute to the STARLight project by accelerating the development of innovative photonic technologies and components. Our expertise in heterogeneous III-V on Silicon integration will help overcome current limitations and meet future application needs. We are enthusiastic about collaborating with key partners such as STMicroelectronics to quickly promote our innovations and address industry constraints, ensuring Europe’s competitiveness in photonics.” – Sébastien Dauvé, CEO, CEA-Leti.

imec
“STARLight offers imec the opportunity to further explore alternative material options to scale its silicon photonics platform to higher transceivers data rates. Imec will leverage its expertise in advanced process development and photonics device research to identify the most suitable technology for the next generations of PIC for optical interconnects.” – Philippe Absil, Vice President R&D at imec.

NVIDIA
“With its contribution to STARLight consortium, NVIDIA continues to support the  advancement of the optical European industry.”

University Paris Saclay
“At University Paris Saclay, the centre for nanoscience and nanotechnology (C2N), a joint unit with also CNRS and University Paris Cité is more specifically involved to demonstrate advanced devices based on the use of new materials and new approaches compatible with STMicroelectronics PIC technology. The collaboration with the main EU players in silicon photonics is an opportunity to have accessed to state-of-the-art technology, to develop innovative devices addressing challenges for applications in silicon photonics and to interact with key industrial partners.” – Laurent Vivien, CNRS director at C2N

Sicoya
“STARLight brings together Sicoya’s long expertise in silicon photonics design and packaging with the transformative capabilities of ST’s PIC technology which allows for superior RF performance by cointegrating advanced photonics and high-speed electronics. The STARLight consortium stands as a strong example of European collaboration, providing the technological foundation for sustainable value creation in a rapidly evolving global market. At a moment where photonics, and especially silicon photonics, is getting widely recognized as a key driving technology for datacenter and AI networks, as well as numerous other critical high-volume applications, Sicoya has now the opportunity to leverage ST’s highly scalable and reliable platform for its future product lineup.” – Hanjo Rhee, CTO at Sicoya GmbH.

 Soitec
“We are proud to take part in the STARLight initiative, a key milestone in strengthening Europe’s leadership in advanced photonics. At Soitec, we are deeply committed to driving innovation at the substrate level—enhancing SOI technology and advancing novel materials to meet the evolving demands of next-generation photonic applications. Through this collaboration, we aim to raise the bar in manufacturing quality, improve scalability, and reduce the environmental footprint of substrate production. Together with our partners, we are laying the technological groundwork for a more competitive and sustainable photonics ecosystem in Europe.” – René Jonker, Executive Vice President, Edge and cloud AI division at SOITEC.

SteerLight
“STEERLIGHT is developing a new generation of 3D vision sensors—non-mechanical FMCW LiDARs—powered by groundbreaking silicon photonics technology that enables the entire system to be integrated onto a microchip. In the coming years, the light-vehicle components market will undergo a significant transformation driven by the rise of advanced driver-assistance systems (ADAS), which require compact, cost-effective, and high-performance LiDAR solutions. Securing sovereign sources of microelectronic components is a strategic priority for STEERLIGHT to enable large-scale production of this next generation of LiDAR systems. This is essential for European players to maintain a leading position in the global value chain and to ensure technological sovereignty in a highly competitive and rapidly evolving sector. The STARLight project will support this goal with ST’s proprietary advanced silicon photonics platform, bringing the capability to industrial maturity.” – François Simoens, CEO and co-founder of SteerLight.

STMicroelectronics
“ST has the technology leadership and the collaborative mindset to support this EU initiative that pushes the boundaries of technology. ST’s new proprietary silicon photonics technology will bring to the consortium the ability to integrate multiple complex components into one single chip, while our unique integrated device manufacturer (IDM) model will enhance silicon photonics innovations within ST 300mm platform for high-volume manufacturing.” – Remi El-Ouazzane, President, Microcontrollers, Digital ICs and RF products Group at STMicroelectronics.  

Thales
“Integrated photonics is set to bring major breakthroughs in the critical system architectures developed by THALES, for sensing, communications, and signal processing. A drastic reduction in size and power consumption offers numerous operational benefits, especially for remote systems. The STARLight project offers a unique opportunity to build upon the STMicroelectronics platform a sovereign EU supply chain for silicon photonics technology.” – Bertrand Demotes-Mainard, VP, CTO Hardware of THALES.

Complete list of participants
AIXSCALE PHOTONICS; ALMAE TECHNOLOGIES; ANSYS; ARISTOTELIO PANEPISTIMIO AUTH EL Y THESSALONIKIS; COMMISSARIAT A L’ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES ; DESIGN AND REUSE; ERICSSON; HELIC ANSYS ELLAS MONOPROSOPH AE; III-V LAB; INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM; KEYSIGHT TECHNOLOGIES; KNOWLEDGE DEVELOPMENT FOR POF SL; LUMIPHASE; MBRYONICS; NVIDIA; NCODIN; RHEINISCH-WESTFAELISCHE HOCHSCHULE AACHEN TECHNISCHE; SICOYA; SOITEC; STEERLIGHT; STMICROELECTRONICS; THALES; UNIVERSITA DEGLI STUDI DI PAVIA; UNIVERSITE PARIS-SACLAY.

In recent years, predictive technologies have revolutionized the healthcare landscape by shifting the focus from reactive treatment to proactive and personalized care. These advancements rely on data analytics, artificial intelligence, and machine learning to anticipate individual health needs, allowing for earlier interventions and more tailored treatment strategies. 

As the healthcare system faces rising costs and increasing demand, predictive technology offers a vital tool to improve outcomes, reduce expenses, and empower individuals to take greater control over their health. By identifying risks before they become crises, predictive solutions are transforming how we approach medical care at both the individual and population levels.

Improving Outcomes Through Early Detection

One of the most impactful benefits of predictive technologies is the ability to detect health issues before they become severe or life-altering. For instance, traumatic brain injuries (TBIs) can have profound and long-lasting effects, both physically and financially. According to Northwestern Now, the lifetime medical costs of a TBI can range from $85,000 to over $3 million. 

With predictive tools analyzing data from wearables, electronic health records, and imaging, physicians can identify early warning signs or high-risk behaviors that may lead to such injuries. In high-risk populations—like athletes, military personnel, and the elderly—these technologies help implement preventative measures that can dramatically reduce the severity or occurrence of TBIs.

Beyond injury prevention, early detection also applies to chronic diseases such as diabetes, hypertension, and heart disease. Predictive analytics can assess risk factors based on genetics, lifestyle, and environmental influences, prompting earlier lifestyle interventions or clinical screenings. This kind of foresight not only enhances patient outcomes but also significantly lowers the financial burden on healthcare systems.

Enhancing Accessibility and Responsiveness

Predictive technologies also play a critical role in making healthcare more accessible and responsive. Healthcare providers increasingly use real-time data to anticipate patient volume, allocate resources, and streamline urgent care services. According to the Urgent Care Association, 26.5% of adults have visited an urgent care facility within the past year, highlighting the growing reliance on immediate and convenient care options.

With predictive systems in place, urgent care centers can better prepare for spikes in demand due to seasonal illnesses, community events, or local outbreaks. Moreover, integrated technology platforms can flag patients who are likely to need urgent care based on their health history and current data trends. This allows for preemptive care coordination and helps reduce wait times, overcrowding, and unnecessary emergency room visits. For patients, this means quicker, more efficient care tailored to their needs—delivered at the right time and place.

Addressing Preventable Health Issues

A major strength of predictive technology is its potential to mitigate preventable health issues through education, monitoring, and timely intervention. For example, untreated dental conditions remain a widespread and often overlooked public health problem. According to Gitnux, around 19% of Americans have untreated cavities—an issue that can lead to more serious health complications if left unaddressed.

Predictive tools can track oral health data and habits, alerting users and healthcare providers about potential problems before they escalate. For patients who may lack regular dental access, mobile health applications and AI-powered virtual consultations can serve as critical touchpoints for prevention and education. In broader public health settings, these technologies allow organizations to identify high-risk groups and deploy targeted outreach programs to improve community health outcomes.

Furthermore, the use of predictive modeling in health insurance, wellness apps, and telemedicine platforms contributes to a more holistic and proactive approach to care. Personalized recommendations based on predictive insights help users make informed decisions about diet, exercise, and medication adherence—ultimately promoting long-term wellness and reducing avoidable complications.

Conclusion

Predictive technologies are reshaping the future of healthcare by enabling personalized, preventative, and data-driven approaches to health management. Whether it’s reducing the risk of costly injuries, improving the efficiency of urgent care services, or addressing preventable conditions like untreated cavities, the application of these tools leads to more effective and individualized care. 

As these technologies continue to evolve and integrate into our daily lives, they offer unprecedented potential to anticipate health needs, reduce systemic strain, and empower individuals to take control of their well-being. The path forward in healthcare is not just about treatment—it’s about prediction, prevention, and personalization powered by technology.