Electronics news & updates

“The approval of the HCL–Foxconn semiconductor project by the Union Cabinet is a strategic breakthrough, not just for India’s semiconductor ambitions but also for Uttar Pradesh, which will now take a vantage position in shaping the country’s semiconductor ecosystem. This project will galvanise the semiconductor manufacturing landscape in the state, attract investments, build local capabilities, and trigger the development of a semiconductor value chain in and around the Jewar region. This partnership further reiterates how global expertise and Indian leadership can come together to build Indian champions that are globally competitive.

I congratulate the teams at HCL and Foxconn for their bold vision and strategic commitment. This initiative brings credibility, confidence, and momentum to India’s semiconductor programme.

We also commend the visionary leadership of Prime Minister Narendra Modi and the relentless drive of Union Minister Ashwini Vaishnaw, whose unwavering focus has put India firmly on the global semiconductor map.

And we remain committed to enabling more such high-impact collaborations that advance India’s goal of becoming a trusted, scalable, and competitive global hub for semiconductor and electronics.”

First product validated at the new RF-shielded anechoic chamber

Bangalore - May 14, 2025 – VIAVI Solutions today announced that Metanoia Communications Inc.'s JURAOpen Radio Unit (O-RU) has successfully completed end-to-end over-the-air (OTA) validation at the VIAVI Automated Lab-as-a-Service (VALOR). It is the first product to be validated at the lab’s new RF-shielded anechoic chamber to ensure compliance with O-RAN and 3GPP specifications.

VALOR is an automated Lab-as-a-Service for Open RAN testing and is funded by the National Telecommunications and Information Administration (NTIA) Public Wireless Supply Chain Innovation Fund. The VALOR lab officially opened on October 7, 2024 in Chandler, Arizona, with the RF chamber and two additional customer labs added to the facility on April 3, 2025.

Metanoia’s O-RU underwent end-to-end performance validation to ensure seamless integration into Open RAN networks, with tests using reference O-CU and O-DU components provided by VALOR and its partners. Tests were conducted over the air within the RF chamber, with VALOR evaluating key performance metrics under realistic radio conditions. Additionally, O-RAN end-to-end functional and performance validation was carried out based on O-RAN TIFG-defined test cases. These tests assessed the system's behavior across the control, user, and management planes, ensuring compliance with key O-RAN architectural and performance requirements in an integrated multi-vendor DU/RU setup.

“The successful validation of Metanoia’s O-RU using the new anechoic chamber is an important milestone for VIAVI and the VALOR lab,” said Erik Probstfield, Senior Director, VALOR, VIAVI. “Open RAN-based systems are set to significantly increase telecoms innovation, but a network is far too complex an environment to rely on trust alone. VALOR, especially with its OTA testing, allows companies such as Metanoia to independently validate the functionality and performance of their hardware, and gives network operators assurance that it will integrate seamlessly into their existing networks.”

“Metanoia is proud to remain at the forefront of 5G innovation, building on our longstanding partnership with VIAVI’s VALOR Lab,” said Didier Boivin, Executive Vice President, Metanoia. “The state-of-the-art OTA chamber, coupled with the company’s extensive testing experience, represent an invaluable resource as we advance our leadership in the Open RAN ecosystem.”

Metanoia’s JURA O-RU is a 4T4R 24dbm 5G FR1 radio unit that supports operation in the sub-6 GHz bands using TDD duplexing. It harnesses the power of its advanced Software Defined Radio (SDR) platform to deliver a flexible, high-performance Open RAN solution for 5G deployments. By combining powerful hardware acceleration with open-source adaptability, JURA O-RU facilitates efficiency and innovation in next-generation wireless networks.

The VALOR RF chamber is the industry’s first Test-as-a-Service offering for Massive MIMO and beamforming OTA validation. It creates a controlled environment that is free from outside interference and emulates multiple real-world scenarios by sending wireless signals to understand a device’s behavior. Created in partnership with ETS-Lindgren, services offered include system-level Massive MIMO performance testing for up to 16 parallel spatial layers.

VALOR enables independent and impartial interoperability, performance, and security testing leveraging VIAVI’s industry-leading NITRO Wireless Open RAN Test Suite and the VAMOS unified framework for hybrid physical and cloud-based testing. Customers can access over 500 test cases compliant with O-RAN WG4, WG5, WG11, TIFG, and 3GPP specifications. VALOR facilitates better readiness for the certification, badging, and acceptance tests at OTICs and CSP labs. It provides services to members of the AI-RAN Alliance and customers referred to the lab by AT&T and Verizon’s ACCoRD, and is the first test service to be authorized by the Telecom Infra Project (TIP) for its system performance certification program.

— AMD EPYC 4005 Processors provide a compelling balance of performance, dependability and efficiency in an affordable, easy-to-deploy platform —

SANTA CLARA, Calif., May 13, 2025 (GLOBE NEWSWIRE) -- AMD (NASDAQ: AMD) today announced the launch of AMD EPYC™ 4005 Series processors. These purpose-built processors enable right-sized solutions with enterprise-class features and leadership performance for small and medium businesses and hosted IT service providers.

AMD EPYC 4005 Series CPUs deliver the performance, features and efficiency growing businesses need to power everything from enterprise applications and virtualized environments to dedicated, all-day hosted services in the cloud. Utilizing the same proven and widely deployed AM5 socket used for the AMD EPYC 4004 Series CPUs, the EPYC 4005 Series delivers an innovative compute solution for a broad set of enterprise-class form factors like servers, blades and towers. In testing on the Phoronix test suite, the EPYC 4565P 16-core bests the top-of-stack 6^th generation Intel Xeon 6300P by 1.83x¹.

“Growing businesses and dedicated hosters often face significant constraints around budget, complexity, and deployment timelines,” said Derek Dicker, corporate vice president, Enterprise and HPC Business Group, AMD. “With the latest AMD EPYC 4005 Series CPUs, we are delivering the right balance of performance, simplicity, and affordability, giving our customers and system partners the ability to deploy enterprise-class solutions that solve everyday business challenges.”

Exceptional Performance and Cost-Efficient Operation

AMD EPYC 4005 Series processors enable a wide array of broadly deployed enterprise solutions and are supported by leading partners and customers including Altos, ASRock Rack, Gigabyte, Lenovo, MiTAC, MSI, New Egg, OVHcloud, Supermicro and Vultr.

"With AMD EPYC 4005 Series processors, Lenovo is providing tailored solutions that prepare small businesses for the AI era,” said Senthil Reddy, Executive Director of Product Management for Infrastructure Solutions Group, Lenovo. “Together, we’re enabling cost-effective, reliable systems that provide enterprise-class features for growing businesses.”

“The AMD EPYC 4005 Series CPUs deliver the compute performance and energy efficiency that our customers have come to expect, in a streamlined platform that supports cost-effective, always-on services,” said Yaniv Fdida, Chief Product and Technology Officer, OVHcloud. “Coupled with OVHcloud’s Open and Trusted Cloud infrastructure, these solutions provide outstanding performance price ratio and scalability for innovative and demanding workloads.”

“We’re excited to expand our portfolio with systems powered by AMD EPYC 4005 Series processors, bringing new levels of value to customers seeking efficient, cost-optimized performance,” said Vik Malyala, President & Managing Director EMEA, SVP, Technology & AI, Supermicro. “From our 3U MicroCloud multi-node platforms to our 1U and 2U mainstream server families, these solutions offer a compelling mix of performance, power efficiency, and deployment flexibility. With support for technologies like PCIe 5.0 and DDR5 memory, we’re enabling IT administrators to deliver more services at lower latency.”

“Vultr is pleased to announce the immediate availability of Bare Metal and Cloud Compute instances featuring AMD EPYC 4005 Series processors,” said J.J. Kardwell, CEO of Vultr. “The AMD EPYC 4005 Series provides straightforward deployment, scalability, high clock speed, energy efficiency, and best-in-class performance. Whether you are a business striving to scale reliably or a developer crafting the next groundbreaking innovation, these solutions are designed to deliver exceptional value and meet demanding requirements now and in the future.”

¹ E4K-021: Geometric Mean of 416 results based on Phoronix Test Suite paid testing as of 04/01/2025.
1P 16C AMD EPYC 4565P-powered server (170W TDP, $589 CPU $, 2 x 32GB DRAM-5600MT/s Kingston, 3201GB Micron_7450_MTFDKCC3T2TFS + 960GB SAMSUNG MZ1L2960HCJR-00A07)
1P 8C Intel Xeon 6369P-powered server (95W TDP, $606 CPU $, 2 x 32GB DRAM-4800MT/s Kingston, 3201GB Micron_7450_MTFDKCC3T2TFS)
Model Geomean Rel2488 Rel6369P
6369P 233.101 1.036 1.000
4565P 426.123 1.894 1.828
AMD 1Ku pricing and Intel ARK.intel.com specifications and pricing as of 4/01/2025. Testing not independently verified by AMD.

² EPYC-018: Max boost for AMD EPYC processors is the maximum frequency achievable by any single core on the processor under normal operating conditions for server systems.

Munich, Germany – 13 May 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces PSOC™ 4100T Plus, an Arm® Cortex®-M0+ microcontroller (MCU) with Multi-Sense. The new microcontroller offers a rich blend of analog and digital capabilities, featuring 128K Flash, 32K SRAM, and Infineon’s high-performance Multi-Sense technology, which includes CAPSENSE™, inductive sensing and liquid level sensing. PSOC 4100T Plus also boasts enhanced reliability and is equipped with a range of enhancements and advanced sensing capabilities to form a complete solution for system control and human-machine interface (HMI) applications. 

“Infineon is committed to delivering best-in-class system control and HMI solutions with enhanced reliability,” says Vibheesh Bharathan, Director and Project Lead for PSOC 4 Multi-Sense from Infineon. “Our Multi-Sense capability represents a paradigm shift, driving next-generation sensing solutions for HMI and system control use cases. In this way, we are enabling the digitalization solutions of tomorrow for consumer and industrial applications.”

PSOC 4100T Plus can be used as a standalone general-purpose microcontroller, providing a robust platform for system control and management OR it can be utilized as a specialized HMI MCU, enabling the creation of intuitive and interactive interfaces. Alternatively, PSOC 4100T Plus can serve a single chip solution for both system control and touch HMI.

In its HMI MCU configuration, the device supports a range of sensing applications, including capacitive sensing for detecting user touch or proximity, inductive sensing for enabling touch over metallic surfaces, Machine Learning (ML) based liquid level sensing for monitoring liquid presence or levels, and CAPSENSE-based hover touch for detecting finger touch through a large airgap, making it a powerful tool for creating innovative and user-friendly interfaces.

PSOC 4100T Plus is a versatile and powerful platform designed to support a broad range of applications. For example:

Home appliances: Reliability is the top priority for home appliances. The PSOC 4100T Plus series addresses this critical requirement with significant enhancements, including 6500 V best-in-class electrostatic discharge (ESD HBM) protection and a 1% internal main oscillator (IMO) accuracy. In addition, the advanced HMI features, such as hover touch, provide a solution to several design challenges, including the need for simplified and cost-effective stack up, touch operation through airgap. With the combination of complementary sensing technologies of Multi-Sense, designers can effectively address the design challenges they face.

Consumer electronics: PSOC 4100T Plus series elevates the human-machine interface capabilities in consumer electronics by providing a compact and efficient solution for sensor designs. Leveraging its 5 ^th Generation CAPSENSE technology, the PSOC 4100T Plus offers high signal-to-noise ratio (SNR) and low power consumption. Additionally, its waterproof design enables the device to operate reliably in harsh environments, including outdoor applications.

Touchpad and touchscreen applications: PSOC 4100T Plus series offers a high resolution 2D finger tracking user interface, enabling the creation touchpads and touchscreens. With 32 sensor inputs, the device can be configured to support up to 256 nodes, allowing for a wide range of design possibilities. For example, a touchpad can be designed with an 80mm x 80mm surface area with a 5mm diamond pitch, resulting in a high-resolution multi-finger tracking. Similarly, a 4-inch touchscreen can be driven by PSOC 4100T Plus for multi-finger use. Both touchpad and touchscreen user interfaces supported with built-in, configurable gesture engine.

To support the development of multi-sense applications, a comprehensive suite of software tools and resources are offered. The CAPSENSE Tuner allows designers to easily configure and optimize capacitive sensing applications, while the Inductive Sensing Design Guide and Liquid Level Sensing Design Guide provide detailed guidance on implementing these technologies. Additionally, the ML-based liquid level sensing model trainer enables developers to overcome challenges like manufacturing variations, varying airgaps with removable tanks.

Availability

The PSOC 4100T Plus is available now. More information is available at www.infineon.com/psoc4100TPlus

Munich, Germany – 12 May 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is introducing the CoolGaN™ bidirectional switch (BDS) 650 V G5, a gallium nitride (GaN) switch capable of actively blocking voltage and current in both directions. Featuring a common-drain design and a double-gate structure, it leverages Infineon's robust gate injection transistor (GIT) technology to deliver a monolithic bidirectional switch, enabled by Infineon's CoolGaN technology. The device serves as a highly efficient replacement for traditional back-to-back configurations commonly used in converters.

The bidirectional CoolGaN switch offers several key advantages for power conversion systems. By integrating two switches in a single device, it simplifies the design of cycloconverter topologies, enabling single-stage power conversion, eliminating the need for multiple conversion stages. This leads to improved efficiency, increased reliability, and a more compact design. BDS-based microinverters also benefit from higher power density and reduced component count, which simplifies manufacturing and reduces costs. Additionally, the device supports advanced grid functions such as reactive power compensation and bidirectional operation.

As a result, this solution holds significant potential across a wide range of applications, including:

Microinverters: The CoolGaN bidirectional switch enables simpler and more efficient microinverter designs, reducing both size and cost. This makes microinverters more attractive for residential and commercial solar installations.

Energy Storage Systems (ESS): In ESS applications such as battery chargers and dischargers, the switch allows for more efficient and reliable energy storage and release.

Electric Vehicle (EV) Charging: In EV charging systems, the BDS switch supports faster, more efficient charging while also enabling vehicle-to-grid (V2G) functionality, where energy stored in the vehicle battery can be fed back into the grid.

Motor control: The CoolGaN BDS is ideal for use in Current Source Inverters (CSI) for industrial motor drives. Compared to traditional Voltage Source Inverters (VSI), CSIs offer benefits such as:

• Producing a sinusoidal output voltage, which supports longer cable runs, reduced losses, and improved fault tolerance.
• Replacing the DC-link capacitor with an inductor, improving high-temperature performance and short-circuit protection.
• Higher efficiency at partial loads, lower EMI, inherent buck-boost capability for voltage variation, and scalability for parallel operation.

These features make CSIs a more robust and efficient alternative for industrial motor applications.

AI data centers: In AI server power supplies, bidirectional switches like CoolGaN support higher switching frequencies and power density in architectures such as Vienna rectifiers and H4 PFCs. A single CoolGaN BDS can replace two conventional switches, reducing component count, cost, size, and overall power losses.

Availability

The CoolGaN bidirectional switch (BDS) 650 V G5 is available for ordering now as well as samples of the 110 mΩ product. More information is available here.

• New Stellar microcontrollers with xMemory enable simpler, more scalable computing platform for developing software-defined vehicles and evolving electric vehicle architectures 
• Extensible capability equips carmakers for continuous innovation, including more memory-hungry AI applications 
• xMemory, based on ST proprietary phase-change memory (PCM) technology, will start production later in 2025

2025 -- STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced Stellar with xMemory, a new generation of extensible memory embedded into its Stellar series of automotive microcontrollers, that transforms the challenging process of developing software-defined vehicles (SDV) and evolving platforms for electrification. 

Instead of managing multiple devices with varying memory options and the associated development and qualification costs, Stellar with xMemory introduces a single, innovative device with extensible memory, providing customers with an efficient and cost-effective solution. This simpler approach from the start enables carmakers to future-proof their designs, with room for additional innovation later in their development cycle, reducing development costs and accelerating time to market with a simpler supply chain. Stellar with xMemory will be first available on the Stellar P6 MCUs, which target the new drivetrain trends and architectures for electric vehicles (EVs), with production to start later in 2025.

 "ST has developed the ultimate memory technology for the automobile market with the smallest bit cell to meet the endless need for more memory. Stellar with xMemory will streamline the car architectures of tomorrow, making them more cost-effective and significantly reduce development time for carmakers,” said Luca Rodeschini, Group Vice President and General Purpose and Automotive Microcontrollers Division General Manager, STMicroelectronics. “This innovative solution enables the same hardware to ensure carmakers have the infrastructure and capabilities with the headroom to continuously innovate their products over time. It provides peace of mind to introduce new innovations in digitalization and electrification, allowing them to stay ahead in the market and extend the lifetime of their vehicles."

“With the embedded Phase Change Memory (PCM) technology, Stellar offers a robust and flexible memory concept to create highly performant, adaptable microcontrollers for automotive usage. The technology provides application advantages compared to other memory technologies, such as RRAM and MRAM,” said Axel Aue, Vice President, Bosch.

“By choosing an extensible MCU like Stellar with xMemory, engineers can avoid costly hardware redesigns to support software features. As software inevitably grows, whether during the initial development or through post-launch OTA updates, the same platform can be upgraded in the field, significantly reducing time-to-market and maintenance costs. A solution like Stellar with xMemory also enables simplified logistics and bill of material efficiency,” said Anshel Sag, Principal Analyst, Moor Insights & Strategy.

How it works

Carmakers need seamless integration of software and hardware to maximize reuse across platforms, extend vehicle longevity and enhance digital capabilities. Memory becomes a bottleneck as software complexity grows, driven by new features and regulations, memory-hungry AI and Machine Learning applications, and over-the-air (OTA) updates. ST’s xMemory addresses this challenge by extending the memory either during the development phase or when vehicle is in the field, giving them unlimited application upgrades.

Selecting the right MCU at the start of the SDV lifecycle ensures sufficient on-chip memory for future software development. Today’s choice of over-specifying memory increases costs, while under-specifying may necessitate finding and re-qualifying a different MCU with extra memory later, adding complexity, cost, and delays. Stellar MCUs with xMemory are competitively priced to bring additional savings, simplify the OEM supply chain, and accelerate time to market by lengthening the product lifetime and maximizing reuse across projects to reduce time for qualification.

Technical notes for editors on PCM and Stellar:

ST has been at the forefront of the transition from Flash to eNVM technology in automotive MCUs, introducing the first 28nm eNVM qualified for automotive applications, which is at the core of the xMemory. ST’s embedded Phase-Change Memory (ePCM) has the best power, performance, area (PPA) index of NVM technologies such as RRAM, MRAM, and Flash.

With the industry’s smallest eNVM cell size, PCM fabricated at 18nm and 28nm nodes provides twice the memory density of other technologies.

The latest-generation PCM technology will be available on all upcoming Arm®-based Stellar P and G automotive MCUs. The Stellar family is dedicated to automotive applications and simplifies vehicle electrical architectures for increased power, flexibility, and safety. The portfolio includes Stellar Integration MCUs (Stellar P and Stellar G series) for centralized zone and domain controllers and body applications, which consolidate the functions of multiple, separate communication and control ECUs, and Stellar Electrification MCUs (Stellar E series), which are optimized for control of EV traction-module power converters. 

For more information, please go to www.st.com/stellar-xmemory 

New Delhi, May 09, 2025: India Cellular and Electronics Association (ICEA) has hailed the India–UK Free Trade Agreement (FTA) as a transformative milestone that will shape the future of the Indian electronics manufacturing sector and partnerships with GVCs. The landmark agreement marks the first comprehensive trade pact between India and the United Kingdom and is set to double bilateral trade from $60 billion to $120 billion by 2030, with India’s exports gaining unprecedented market access in the United Kingdom. 

Under the visionary leadership of Hon’ble Prime Minister Shri Narendra Modi, India has reaffirmed its capability to negotiate equitable and forward-looking global trade frameworks that accelerate growth, innovation, and economic collaboration. The agreement eliminates tariffs on 99% of Indian exports, expanding special access to domestically manufactured electronics, engineering goods, auto components, IT services, and more. 

The FTA eases the employment opportunities for Indian professionals including Contractual Service Suppliers, Business Visitors, Intra-Corporate Transferees and dependent children of Intra-Corporate Transferees with right to work. 

It empowers MSMEs, startups, and professionals by strengthening their participation in global value chains. The inclusion of a three-year exemption from social security contributions for Indian professionals working in the UK is especially progressive, enabling greater earnings and mobility for India’s skilled workforce, particularly in the IT and services sectors.

As India’s role as “Vishwa Mitra – Trusted Partner of the World” continues to expand, the India–UK FTA stands as a model for how democratic nations can co-create resilient supply chains, promote sustainable development, and generate high-quality employment.

Mr. Pankaj Mohindroo, Chairman, ICEA, stated: “The India–UK FTA is a strategic leap to a new era of economic ties and opportunities for Indian companies to better access international markets and work with UK-based GVCs. It represents India's growing maturity and confidence in shaping future-ready, innovation-driven trade partnerships that will benefit the people-to-people ties as well. This agreement will be beneficial for industries across the board, including the electronics sector.” 

“Today, the UK imports $80.5 billion of electronics goods from various geographies and a mere $2 billion from India. This FTA will facilitate export opportunities for the Indian electronics industry to have a major share of UK’s electronics imports, helping India move swiftly towards its electronics export target of $180–200 billion by 2031,” he added.

ICEA also extends its appreciation to Hon’ble Commerce & Industry Minister Shri Piyush Goyal and his team for their relentless and strategic negotiations in bringing this visionary agreement to fruition.

The India–UK FTA reaffirms India’s place on the world stage as a confident, capable, and committed partner in building a more prosperous and resilient global economy.

Bangalore - May 8, 2025 – VIAVI Solutions today announced its participation in the Mobile Radio for Railways Networks in Europe 2 (MORANE-2) project, which will test Future Railway Mobile Communication System (FRMCS) specifications in real-world conditions and pave the way for digital railway communication. A global leader in railway test and monitoring solutions, VIAVI is one of only a few monitoring suppliers supporting the MORANE-2 project.

The current Global System for Mobile Communications – Railway (GSM-R) is expected to begin its phase out by 2030 and FRMCS is emerging as a clear successor. VIAVI’s EVOIA Drive Test will be used to help deploy the new FRMCS network. In addition, EVOIA Assure will monitor and evaluate FRMCS prototypes in both laboratory settings and on railway tracks to ensure they meet the evolving demands of current and future rail networks. This includes support for the European Train Control System (ECTS), Automatic Train Operation (ATO), and real-time data and video services.

“We are proud to contribute to MORANE-2, a groundbreaking initiative to ensure efficient, sustainable and resilient railway communications,” said Max Beccuti, Railway Product Line Manager, VIAVI. “As a leader in mission-critical network testing and measurement, VIAVI contributes to this project by designing technical metrics, defining KPIs, and offering state-of-the-art monitoring and active test solutions for testing FRMCS network specifications.”

MORANE-2 aims to validate product development standards and is expected to run for 34 months between 2024 – 2027. The project will enable the inclusion of FRMCS specifications in the Technical Specifications for Interoperability (TSI), which defines the technical and operational standards that each subsystem, or part of a subsystem, must meet to satisfy essential requirements and ensure the interoperability of railway systems. A collaborative European initiative funded by Europe’s Rail (EU-RAIL) and the European Smart Networks and Services Joint Undertakings, the MORANE-2 project represents a significant step toward modernizing railway telecommunications across Europe, enhancing efficiency, sustainability and digital connectivity.

VIAVI has demonstrated its robust test, measurement and monitoring solutions at several events. In the railway sector, this included making a presentation at the 2024 UIC (International Union of Railways) FRMCS Global Conference in Paris and debuting as an exhibitor at InnoTrans, the world’s largest railway exhibition.

The VIAVI Mission Critical and Railway team will host its annual Railway User Group in Stockholm on June 3-5. The VIAVI team will also attend the 5x5: The Public Safety Innovation Summit on June 3-5 in Seattle, and TCCA Critical Communications World 2025 on June 17-19 in Belgium.

VIAVI is a member of UNIFE, the European association representing the rail supply industry, which advocates for innovation, sustainability and standardization in railway systems.